Laser cutting method

Abstract

The invention provides a laser cutting method. According to the laser cutting method, the cutting track of a to-be-cut substrate is covered with a heat absorbing layer before the laser cutting operation is performed, so that the heat energy of a laser can be partially absorbed by the heat absorbing layer when the to-be-cut substrate is cut by the laser along the cutting track of the to-be-cut substrate; accordingly, the temperature gradient between the cutting position on the to-be-cut substrate and non-cutting positions around the cutting position during the cutting process can be reduced, the heat stress can be reduced, and then cracks and other defects can be reduced; and a relatively-high-quality product can be obtained.

Description

technical field [0001] The invention relates to the technical field of display panel manufacturing, in particular to a laser cutting method. Background technique [0002] In the manufacturing process of the existing display panel, the whole motherboard is usually cut to obtain a display panel with a suitable size. Among them, laser cutting is a commonly used method. However, in the process of laser cutting, due to the high energy density of the laser, a large temperature gradient is generated between the cutting position and its surrounding non-cutting positions, resulting in thermal stress between the cutting position and its nearby positions. Furthermore, it is easy to generate cracks in the direction of pressing the temperature gradient. Especially for irregular cutting areas such as chamfering and perforation, it is easy to generate irregular deformation and concentration of thermal stress, thus more likely to generate defects such as cracks, which further affects the ...

AI Technical Summary

Problems solved by technology

However, in the process of laser cutting, due to the high energy density of the laser, a large temperature gradient is generated between the cutting position and its surrounding non-cutting positions, resulting in thermal stress between the cutting position and its nearby positions. In turn, it is easy to produce cracks in the direction of the temperature gradient

Especially for irregular cutting areas such as chamfering and perforation, it is easy to produce irregular deformation and concentration of thermal stress, which makes cracks and other defects more likely to occur, which in turn affects the quality of display panel products

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