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Heat dissipation material adhering composition, heat dissipation material having adhesive, inlay substrate, and method for manufacturing same

A technology of heat-dissipating material and composition, applied in the direction of adhesive heating bonding method, adhesive type, film/sheet adhesive, etc., can solve the problem of falling heat-dissipating material, insufficient pressure, and cost increase problem, to achieve the effect of easy fixation, stable adhesion, and ensured adhesion

Active Publication Date: 2018-02-16
TATSUTA ELECTRICWIRE & CABLE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, in the case of using this method, it becomes a manual work, so the cost tends to increase, the pressure is insufficient, and there are problems such as falling of the heat dissipation material.

Method used

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  • Heat dissipation material adhering composition, heat dissipation material having adhesive, inlay substrate, and method for manufacturing same
  • Heat dissipation material adhering composition, heat dissipation material having adhesive, inlay substrate, and method for manufacturing same
  • Heat dissipation material adhering composition, heat dissipation material having adhesive, inlay substrate, and method for manufacturing same

Examples

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Embodiment

[0069] Hereinafter, although the Example of this invention is shown, this invention is not limited to the following Example. In addition, in the following, unless otherwise specified, a compounding ratio etc. shall be based on mass.

[0070] According to the formula shown in the following Table 1, the resin component (resin or resin solution), curing agent, and silver-coated copper powder as an inorganic filler were mixed to manufacture a heat dissipation material bonding composition. It should be noted that the density of the silver-coated copper powder is 9.1g / cm 3 , The density of other raw materials is 1.1g / cm 3 , the volume % (vol%) of silver-coated copper powder can be calculated.

[0071] Solid epoxy resin 1: Trisphenol-type epoxy resin, "VG3101L" manufactured by PRINTEC, INC., 50% by mass methyl ethyl ketone solution

[0072] Solid epoxy resin 2: Bisphenol A type epoxy resin, "JER1010" manufactured by Mitsubishi Chemical Corporation, 50% by mass methyl ethyl ketone ...

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Abstract

Provided are a heat dissipation material capable of ensuring stable adhesion while reducing cost, an inlay substrate using the same, and a method for manufacturing the same. According to the present invention, a heat dissipation material having an adhesive, in which the heat dissipation material is partially or totally coated, is obtained, by using a heat dissipation material adhering compositionthat contains an inorganic filler, a curing agent, and a resin component including an epoxy resin, and of which the complex viscosity at 80 DC is 1*103-5*106Pas.

Description

technical field [0001] The present invention relates to a heat dissipation material mainly for the purpose of heat dissipation of a substrate, an embedded substrate using the same, and a manufacturing method thereof. Background technique [0002] The function of dissipating heat is required for boards on which power supply modules, high-power LEDs, etc. are mounted. For this purpose, conventionally, as in the embedded substrate disclosed in Patent Document 1, an operation of providing a hole in the substrate and inserting a heat dissipation material for heat dissipation of the substrate has been performed. As a manufacturing method of embedding the substrate, for example, a method of inserting a heat dissipation material into the substrate, applying pressure from above, and plastically deforming and fixing the substrate is used. However, in the case of using this method, since it becomes a manual work, the cost tends to become high, the pressure is insufficient, and problem...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J5/06C09J11/04H01B13/00C09J7/20C09J7/30
CPCC09J5/06C09J11/04C09J163/00H01B13/00C09J2400/10C09J2463/00C09J7/20C09J7/30C09J2301/408C09J2301/312H05K1/0206C08K3/042C08K3/08C08K3/22C08K3/36C08K2003/0806C08K2003/0831C08K2003/0862C08K2003/2227C08L63/00
Inventor 梅田裕明松田和大汤川健
Owner TATSUTA ELECTRICWIRE & CABLE
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