Double-blanking device through IC

Abstract

The invention discloses an IC double unloading device and a unloading method thereof. It is equipped with raceway interface, material distribution mechanism, material transfer roller mechanism, material box clamping mechanism, material box storage mechanism, material pushing motor, moving base, track driving motor, track width adjusting screw, pushing track, baffle, Pushing piece cylinder, forward and backward moving servo motor, pushing track, pushing piece, linear module, servo motor with brake, clamping box cylinder, forward and backward moving cylinder, linear guide rail, base plate, clamping box mechanism, box width adjustment Mechanism, material box conveying track, rolling out motor, material box width adjustment mechanism bracket, installation mechanism bracket, the whole blanking process of the present invention all adopts automatic control, realizes intelligent production, and this invention adopts double blanking mechanism, thereby greatly Increased production capacity and reduced work intensity of workers.

Description

technical field [0001] The invention relates to the technical field of electronic production and manufacturing, in particular to an IC double feeding device. Background technique [0002] Packaging technology began in the 1960s. With the successful development of high-end packaging equipment such as ball planting machines, it has become the mainstream packaging method in the market. In actual production, BGA chips are relatively expensive, and the chip damage is often only the damage of the solder ball pins, and its internal circuit is intact. Therefore, chip rework becomes very necessary. At present, there are three ways to repair chips: manual repair, simple repair device, and chip repair ball planting machine. Manual rework and simple rework devices can only perform rework on a small number of chips, with low efficiency and low output. Although the chip rework and ball planting machine is relatively expensive, its high productivity has greatly reduced the price of BGA ...

AI Technical Summary

Problems solved by technology

Manual rework and simple rework devices can only rework a small number of chips, with low efficiency and low output

Although the chip rework and ball planting machine is relatively expensive, its high productivity has greatly reduced the price of BGA chips

At present, it is not only inefficient to use hand-held tweezers to cut the reworked chips and detect the effect of ball placement with human eyes, but also the detection results vary from person to person, which is unstable and unreliable

Since people hold tweezers in direct contact with the chip, it is easy to make mistakes, resulting in the destruction of the planted solder balls, which increases the defective rate of the product

[0003] Manual blanking has the following unavoidable disadvantages: low efficiency, only one chip can be clamped with tweezers at a time for blanking, which consumes a lot of time and affects production capacity

Manual hand-held tweezers directly contact with the chip, misoperation, resulting in an increase in the defective rate of the product

Artificial naked eye detection of ball planting quality is unreliable and unstable

It cannot match the capacity of efficient chip rework and ball planting machines

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