Double-blanking device through IC

Abstract

The invention discloses a double-blanking device through an IC and a blanking method thereof. The device comprises a double-blanking device body, a blanking mechanism, a material separation mechanism,a material box clamping mechanism and a material box storage mechanism. A rolling way connector, the material separation mechanism, a material conveying roller mechanism, the material box clamping mechanism, the material box storage mechanism, a material pushing sheet motor, a mobile base, a rail transmission motor, a rail width adjustment lead screw, a pushing rail, a baffle, a material pushingsheet air cylinder, a front-back mobile servo motor, a material pushing rail, a material pushing sheet, a straight-line module, a servo motor with a brake, a material clamping box air cylinder, a front-back mobile air cylinder, a straight-line guide rail, a baseplate, a material clamping box mechanism, a material box width adjustment mechanism, a material box conveying rail, a rolling-out motor, amaterial box width adjustment mechanism support and a mounting mechanism support are arranged on the double-blanking device body. According to the double-blanking device through the IC, automatic control is completely adopted in the whole blanking process, intelligent production is achieved, a double-blanking mechanism is adopted, accordingly, the productivity is greatly improved, and the workingintensity of workers is also lowered.

Description

technical field [0001] The invention relates to the technical field of electronic production and manufacturing, in particular to an IC double feeding device. Background technique [0002] Packaging technology began in the 1960s. With the successful development of high-end packaging equipment such as ball planting machines, it has become the mainstream packaging method in the market. In actual production, BGA chips are relatively expensive, and the chip damage is often only the damage of the solder ball pins, and its internal circuit is intact. Therefore, chip rework becomes very necessary. At present, there are three ways to repair chips: manual repair, simple repair device, and chip repair ball planting machine. Manual rework and simple rework devices can only perform rework on a small number of chips, with low efficiency and low output. Although the chip rework and ball planting machine is relatively expensive, its high productivity has greatly reduced the price of BGA ...

AI Technical Summary

Problems solved by technology

Manual rework and simple rework devices can only rework a small number of chips, with low efficiency and low output

Although the chip rework and ball planting machine is relatively expensive, its high productivity has greatly reduced the price of BGA chips

At present, it is not only inefficient to use hand-held tweezers to cut the reworked chips and detect the effect of ball placement with human eyes, but also the detection results vary from person to person, which is unstable and unreliable

Since people hold tweezers in direct contact with the chip, it is easy to make mistakes, resulting in the destruction of the planted solder balls, which increases the defective rate of the product

[0003] Manual blanking has the following unavoidable disadvantages: low efficiency, only one chip can be clamped with tweezers at a time for blanking, which consumes a lot of time and affects production capacity

Manual hand-held tweezers directly contact with the chip, misoperation, resulting in an increase in the defective rate of the product

Artificial naked eye detection of ball planting quality is unreliable and unstable

It cannot match the capacity of efficient chip rework and ball planting machines

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