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Gluing method based on distributed pressure sensing technology

A sensing technology and pressure sensor technology, applied in the field of distributed pressure sensing technology, can solve the problems of poor bonding effect, uneven pressure distribution, etc., to avoid bonding quality problems, improve quality, and glue bonding operations. easy effect

Inactive Publication Date: 2018-02-23
国营芜湖机械厂
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  • Summary
  • Abstract
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AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is that in the bonding process of the traditional technology, the bonding effect after pressure relief will be poor due to uneven pressure distribution, and a bonding method based on distributed pressure sensing technology is proposed

Method used

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  • Gluing method based on distributed pressure sensing technology

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Embodiment Construction

[0012] In order to make it easy to understand the technical means, creative features, achieved goals and effects of the present invention, the present invention is further described below.

[0013] like figure 1 The method step diagram shown:

[0014] A glue bonding method based on distributed pressure sensing technology, the steps of the glue bonding method are:

[0015] S1) Customized film pressure sensor: Customize the film pressure sensor according to the size and shape of the glued area. The film pressure sensor is composed of a force-sensitive resistor array evenly distributed according to the glued area. The pressure generated by the splint on the glued area will change. The resistance of the force-sensitive resistor converts the pressure signal into a voltage signal through the voltage divider circuit;

[0016] S2) Connect the data acquisition handle: connect the film pressure sensor to the data acquisition handle, and connect the data acquisition handle to the compu...

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Abstract

The invention relates to a gluing method based on a distributed pressure sensing technology. The gluing method comprises the steps of: adopting a pressure sensor to be placed between a pressing plateand a gluing surface during the gluing process; and detecting pressure by means of a data acquisition handle and supporting software, and adopting a clamp for clamping, wherein the pressure sensor adopts a thin-film pressure sensor, a clamping plate adopts an organic glass clamping plate, and the clamp adopts an F-shaped ratchet rapid clamp. The gluing method disclosed by the invention effectivelyavoids the adhering quality problem caused by pressure negative different, enhances the quality and is simpler in gluing operation.

Description

technical field [0001] The invention relates to the technical field of gluing, in particular to a gluing method based on distributed pressure sensing technology. Background technique [0002] Adhesive bonding is a process method that uses the mechanical bonding force, physical adsorption force and chemical bonding force generated by the adhesive on the connecting surface to connect two glued parts. In the bonding process, a specified pressure is applied to the part to achieve the best bond strength. The use of mechanical pressure in the traditional bonding process will cause uneven force. Taking a certain glass edge bonding as an example, at 160cm 2 In the bonding area, 11 constant-force spring clips (40KG / piece) are installed on the metal pressure plate, and the theoretical pressure in the bonding area is 0.275mpa. The stress concentration phenomenon that the mouth is sending out causes uneven pressure distribution, and even some areas are not stressed. After the pressure...

Claims

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Application Information

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IPC IPC(8): G01L1/20G01L1/22F16B11/00
CPCF16B11/006G01L1/205G01L1/22
Inventor 王鹏飞谢金标许光群
Owner 国营芜湖机械厂
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