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LED bead and fabrication method thereof

A technology of LED lamp beads and chips, applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of fluorescent glue that is not resistant to high temperature and fluorescent glue that is prone to cracking

Inactive Publication Date: 2018-02-23
TCL VERY LIGHTING TECH HUIZHOU CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] Based on this, it is necessary to provide an LED lamp bead and a preparation method thereof for the technical problem that the fluorescent glue is not resistant to high temperature and the LED chip emits a large amount of heat during operation, which causes the fluorescent glue to crack easily.

Method used

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  • LED bead and fabrication method thereof
  • LED bead and fabrication method thereof
  • LED bead and fabrication method thereof

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Embodiment Construction

[0021] In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, the present invention can be implemented in many other ways different from those described here, and those skilled in the art can make similar improvements without departing from the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

[0022] In the present invention, unless otherwise clearly specified and limited, the first feature may be in direct contact with the first feature or the first and second feature may be in direct contact with the second feature through an intermediary. touch. Moreover, "above", "above" a...

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Abstract

The invention discloses an LED bead and a fabrication method thereof. The fabrication method of the LED bead comprises the steps of providing a substrate; inversely arranging an LED chip on the substrate; forming a protection layer around the LED chip, wherein a surface of the protection layer is at least flush with an emergent surface of the LED chip; arranging a ceramic fluorescent layer on theLED chip, wherein at least one part of the ceramic fluorescent layer is arranged on the protection layer around the LED chip; and removing the substrate. The LED bead comprises the LED chip, the protection layer and the ceramic fluorescent layer, wherein the protection layer is arranged around the LED chip, and the ceramic fluorescent layer is arranged on the emergent surface of the LED chip. According to the LED bead and the fabrication method thereof, the ceramic fluorescent layer is arranged on the emergent surface of the LED chip; and compared with a fluorescent glue layer arranged on theemergent surface of a traditional LED chip, the ceramic fluorescent layer has the advantages that ceramic resists to a high temperature, thus, a surface of the fabricated LED bead is difficult to crack, and the emergent effect is favorable.

Description

technical field [0001] The invention relates to the technical field of LEDs, in particular to an LED lamp bead and a preparation method thereof. Background technique [0002] In recent years, with the continuous progress of LED research on device materials, chip technology, packaging process technology, etc., especially with the gradual maturity of flip-chip production and the diversification of phosphor coating technology, a new CSP ( Chip ScalePackage, chip size package) technology came into being. Due to the advantages of maximizing luminous flux per unit area (high optical density) and maximizing the cost ratio of chip and packaging BOM (Bill of Material, bill of materials) (low packaging cost), it is expected to open a subversive breakthrough in cost performance. [0003] In addition to the potential cost reduction advantages of CSP technology, in the application of lamps and lanterns, the size of the packaged product made by CSP technology is greatly reduced, which ca...

Claims

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Application Information

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IPC IPC(8): H01L33/54H01L33/50H01L33/00
CPCH01L33/502H01L33/005H01L33/54
Inventor 张国波
Owner TCL VERY LIGHTING TECH HUIZHOU CO LTD
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