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An ess audio circuit noise reduction structure and noise reduction method

An audio circuit and audio chip technology, applied in electrical components, frequency response correction, signal processing, etc., can solve problems such as noise, mutual interference between the main board and A small card, and achieve the effect of reducing noise, preventing interference and improving audio quality.

Active Publication Date: 2020-08-25
INSPUR SUZHOU INTELLIGENT TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, a single cable is used to connect the main board and the A small card, and the main board and the A small card are all connected together, especially the GND pin on the main board and the GND_A pin of the A small card are also connected to the ESS audio chip and the handset. Connected together, causing mutual interference between the main board and the A small card, resulting in a certain amount of noise

Method used

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  • An ess audio circuit noise reduction structure and noise reduction method
  • An ess audio circuit noise reduction structure and noise reduction method
  • An ess audio circuit noise reduction structure and noise reduction method

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Embodiment 1

[0032] Such as figure 2 An ESS audio circuit noise reduction structure shown, the structure includes a main board and a small card, the main board is provided with an ESS audio chip, a GND pin and a first AGND2 pin, and the ESS audio chip passes through The first AGND2 pin is grounded separately, and the GND pin is grounded separately; the A small card is provided with a receiver, a GND_A pin and a second AGND2 pin, and the receiver is grounded separately through the second AGND2 pin , the GND_A pin is grounded alone.

[0033] Such as image 3 As shown, the embodiment of the present invention also provides an ESS audio circuit noise reduction method, the method comprising:

[0034] S1: Set the first AGND2 pin on the motherboard, and connect the ESS audio chip and ground respectively.

[0035] S2: Set the second AGND2 pin on the A small board, and connect the earphone and ground respectively.

Embodiment 2

[0037] Such as figure 2 An ESS audio circuit noise reduction structure shown, the structure includes a main board and a small card, the main board is provided with an ESS audio chip, a GND pin and a first AGND2 pin, and the ESS audio chip passes through The first AGND2 pin is grounded separately, and the GND pin is grounded separately; the A small card is provided with a receiver, a GND_A pin and a second AGND2 pin, and the receiver is grounded separately through the second AGND2 pin , the GND_A pin is grounded alone.

[0038] Such as Figure 4 As shown, U12 is the main chip of the ESS chip, the INL pin of the ESS audio chip is connected to DACL, the INBL pin is connected to DACLB, and DACL and DACLB adopt differential wiring. The INR pin of the ESS audio chip is connected to DACR, the INBR pin is connected to DACRB, and DACR and DACRB adopt differential wiring.

[0039] Such as Figure 5 As shown, the embodiment of the present invention also provides an ESS audio circuit...

Embodiment 3

[0045] Such as figure 2 An ESS audio circuit noise reduction structure shown, the structure includes a main board and a small card, the main board is provided with an ESS audio chip, a GND pin and a first AGND2 pin, and the ESS audio chip passes through The first AGND2 pin is grounded separately, and the GND pin is grounded separately; the A small card is provided with a receiver, a GND_A pin and a second AGND2 pin, and the receiver is grounded separately through the second AGND2 pin , the GND_A pin is grounded alone.

[0046] Such as Figure 4 As shown, the INL pin of the ESS audio chip is connected to DACL, the INBL pin is connected to DACLB, and DACL and DACLB adopt differential wiring. The INR pin of the ESS audio chip is connected to DACR, the INBR pin is connected to DACRB, and DACR and DACRB adopt differential wiring. Such as Image 6As shown, R527 / R528 is connected in series with SUS_SMBCLK and SUS_SMB_DAT, mainly to allow the CPU on the motherboard to communicate...

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Abstract

The invention provides an ESS audio circuit noise-reduction structure and method. The structure comprises a mainboard and an A small card; an ESS audio chip, a GND pin and a first AGND2 pin are arranged on the mainboard; the ESS audio chip is independently grounded through the first AGND2 pin; the GND pin is independently grounded; a headphone, a GND_A pin and a second AGND2 pin are arranged on the A small card; the headphone is independently grounded through the second AGND2 pin; and the GND_A pin is independently grounded. The method comprises the steps of: S1, setting the first AGND2 pin onthe mainboard, and separately connecting the ESS audio chip and grounding; and S2, setting the second AGND2 pin on the A small card, and separately connecting the headphone and grounding. The independent pin AGND2 is independently configured for the ESS audio chip and the headphone; therefore, interference among circuits can be effectively avoided; and thus, noise is reduced.

Description

technical field [0001] The invention relates to the technical field of noise elimination, in particular to an ESS audio circuit noise reduction structure and a noise reduction method. Background technique [0002] ESS's headphone system mainly includes DAC and Amplifier, because of its good compatibility and high cost performance, it is currently used as a sound card in many servers. [0003] Currently, in the existing technology, such as figure 1 As shown, the entire ESS earphone system is divided into the main board and the A small card on the audio circuit line. The ESS audio chip (ESS CHIP) is mainly installed on the main board, and the earphone (Headphone) is set on the A small card. The main board and the A small card are transparent. The reason for connecting the opposite positions through cables is that the main chip ESS CHIP is too far away from the sound interface, so use CABLE and A small card to realize it. [0004] However, a single cable is used to connect th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04R3/04
CPCH04R3/04H04R2430/00
Inventor 王榆锋
Owner INSPUR SUZHOU INTELLIGENT TECH CO LTD