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Electroplating tank

A technology for electroplating tanks and tank bodies, applied in the direction of plating tanks, etc., can solve the problem that the crystallization of the plating solution is easy to damage the sealing effect, and achieve the effect of preventing crystallization and improving sealing

Active Publication Date: 2018-03-06
ACM RES SHANGHAI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Aiming at the problem that the sealing effect of the existing electroplating tank is easily damaged due to the crystallization of the plating solution, the present invention proposes an electroplating tank

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] Such as figure 1 The illustrated electroplating tank includes a tank body 101 and an anode plate 102 . The anode plate 102 is T-shaped, and the free end in the vertical direction is threaded. There is a through hole at the bottom of the tank body 101. The anode plate 102 is arranged on the tank body 101 through the through hole and the nut, so as to better fix the anode The plate 102 is usually secured using double nuts. In order to ensure the sealing effect of the electroplating tank, an inner sealing ring 103 is provided between the tank body 101 and the anode plate 102, and the inner sealing ring 103 is usually an O-ring. There is a ring of deionized water tank 104 outside the inner sealing ring 103, and the deionized water tank 104 is arranged on the tank body 101, and the deionized water tank 104 and the inner sealing ring 103 form a concentric ring. The deionized water tank 104 is suitable for containing deionized water. The deionized water can effectively dilut...

Embodiment 2

[0022] figure 2 Shown is another embodiment of an electroplating tank, including a tank body 201 and an anode plate 202 . The anode plate 202 is T-shaped, and the free end in the vertical direction is threaded. There is a through hole at the bottom of the tank body 201. The anode plate 202 is fixed on the tank body 201 through the through hole and the nut. In order to better fix the anode The plate 202 is usually secured using double nuts. In order to ensure the sealing effect of the electroplating tank, a double sealing ring sealing method is adopted, that is, an inner sealing ring 203 and an outer sealing ring 205 are arranged between the tank body 201 and the anode plate 202, and the two sealing rings can be concentric rings, and the inner sealing ring Ring 203 and outer seal ring 205 are typically O-ring seals. There is an annular U-shaped groove on the contact surface between the tank body 201 and the two sealing rings, and the sealing ring is pressed into the U-shaped...

Embodiment 3

[0025] image 3 Shown is yet another specific embodiment of the electroplating tank, including a tank body 301 and an anode plate 302 . The anode plate 302 is T-shaped, and the free end in the vertical direction is threaded. There is a through hole at the bottom of the tank body 301. The anode plate 302 is fixed on the tank body 301 through the through hole and the nut. In order to better fix the anode Plate 302, usually secured with double nuts. In order to ensure the sealing effect of the electroplating tank, a double sealing ring sealing method is adopted, that is, an inner sealing ring 303 and an outer sealing ring 305 are arranged between the tank body 301 and the anode plate 302. The two sealing rings can be concentric rings, and the inner sealing ring Ring 303 and outer seal ring 305 are typically O-ring seals. There is an annular U-shaped groove on the contact surface between the tank body 301 and the two sealing rings, and the sealing ring is pressed into the U-shap...

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PUM

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Abstract

The invention discloses an electroplating tank, which comprises a tank body and an anode plate arranged at the bottom portion of the tank body, wherein an inner sealing ring is arranged between the tank body and the anode plate, a ring-shaped deionized water tank is arranged on the tank body, and is positioned on the outer side of the inner sealing ring, and the anode plate covers and presses thedeionized water tank. According to the present invention, the deionized water tank is additionally arranged on the outer side of the inner sealing ring so as to effectively dilute the infiltrated plating solution, such that the damage of the plating solution crystallization on the sealing effect due to the infiltrating of the plating solution around the inner sealing ring can be prevented.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to an electroplating bath. Background technique [0002] When electroplating parts, the most commonly used tool is the electroplating tank. The electroplating tank is the most basic accessory in the electroplating device. It is used to install the solution for galvanizing, copper plating, nickel plating, gold plating, etc. During electroplating, the plated metal or other insoluble inert material is used as the anode, and the workpiece to be plated is used as the cathode, and the cations of the plated metal are reduced on the surface of the workpiece to be plated to form a coating. [0003] In the existing electroplating tanks, a sealing ring is usually added between the tank body and the anode plate to achieve a good sealing effect in order to avoid running, emitting, dripping, wasting the plating solution and polluting the environment. During the use of the electroplatin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D17/02
CPCC25D17/02
Inventor 王晖杨宏超贾照伟吴均王坚
Owner ACM RES SHANGHAI
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