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Temperature measurement probe and packaging method

A technology of a temperature measuring probe and a packaging method, which is applied to measuring devices, thermometers, measuring heat, etc., can solve the problems of difficult injection of thermal conductive sealant and reduced measurement accuracy, and achieve the effect of convenient and fast injection.

Pending Publication Date: 2018-03-06
承德兴春和农业股份有限公司
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  • Application Information

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Problems solved by technology

[0004] The purpose of the present invention is to provide a temperature measuring probe to solve the technical problems existing in the prior art, such as the difficulty in injecting heat-conducting sealants and the reduction of measurement accuracy due to the formation of cavities inside.

Method used

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  • Temperature measurement probe and packaging method

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Embodiment Construction

[0028] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0029] It should be noted that when an element is referred to as being “fixed” or “disposed on” another element, it may be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0030] It is to be understood that the terms "length", "width", "top", "bottom", "front", "rear", "left", "right", "vertical", "horizontal", "top" , "bottom", "inner", "outer" and other indicated orientations...

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Abstract

The invention provides a temperature measurement probe and a packaging method and belongs to the technical field of temperature measurement devices. According to the invention, heat conducting seal glue is injected into a housing via an injection hole arranged on one side, adjacent to a plug, of the housing. An injector or other aid tools can be used for injection. The glue injection process is convenient and quick. According to the invention, the heat conducting seal glue is injected into the housing and then a sensor part provided with a cable is inserted into the heat conducting seal glue.Air extruded during the sensor insertion process runs from the upper part. Then the heat conducting seal glue is injected into the housing via the injection hole again and total immersion of the sensor is ensured and bubble cavities are avoided. Therefore, a problem of measurement precision decrease due to heat conducting glue injection difficulties and internal cavity formation is solved.

Description

technical field [0001] The invention belongs to the technical field of temperature measuring equipment, and more specifically relates to a temperature measuring probe and a packaging method thereof. Background technique [0002] The packaging method of the temperature measuring probe in the prior art is as follows: after the plug is welded to the shell, the heat-conducting sealant is injected into the shell, and then the sensor with the cable is inserted into the heat-conducting sealant. The problem with this technology is that it is difficult to inject heat-conducting sealant from the back of the shell, and since there is no exhaust device in the plug part, a cavity will inevitably be formed, which will affect the measurement accuracy of the temperature measuring probe. [0003] Therefore, how to provide a temperature measuring probe that can solve the problems of difficulty in injecting heat-conducting sealant and the reduction of measurement accuracy due to the formation ...

Claims

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Application Information

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IPC IPC(8): G01K1/14G01K1/08
CPCG01K1/14
Inventor 王春宝温婧刘阳刘志超姜涛王小伟
Owner 承德兴春和农业股份有限公司
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