Adjustable test bed of nails for circuit board

A test bed of needles and adjustable technology, applied in the field of test needle beds, can solve the problems of fixed device structure, poor applicability, inability to adjust conveniently, etc., achieve simple device structure, flexible and convenient adjustment operation, improve control efficiency and The effect of processing power

Inactive Publication Date: 2018-03-06
芜湖欣宏电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The publication number is 205049623U, which is a test needle bed for circuit boards, including probe needles, and the test needle bed also includes a printed circuit board and a fixing structure, and the circuit board to be tested is arranged on the printed circuit board. The detection pin hole that is adapted to the insertion pin hole of the board; the detection pin inserted in the detection pin hole is firmly welded on the printed circuit board through one end; during the testing process of the circuit board, the The probe needle is supported, fixed and limited by the fixed structure; although the device can realize the general test operation of the circuit board, the structure of the device is relatively fixed and cannot be adjusted conveniently, so the applicability is poor

Method used

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  • Adjustable test bed of nails for circuit board

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Embodiment

[0023] Such as figure 1 As shown, the present invention provides an adjustable test bed of needles for circuit boards, including an adjustable support base 1, the top of the adjustable support base 1 is fixed with a fixed base plate 2, and the center of the fixed base plate 2 is A circular threaded fixing hole 3 is excavated on the surface. The adjustable support base 1 includes a lifting motor 101. The output shaft of the lifting motor 101 is sleeved with a lifting sleeve shaft 102. The top of the lifting sleeve shaft 102 is engraved with The external thread is matched with the threaded fixing hole 3; the lifting motor 101 is used to control the up and down operation. The adjustment operation of the height of the top fixed bottom plate 2 can also be easily disassembled;

[0024] The center of the upper surface of the fixed base plate 2 is dug with a fixed groove 10, and the inside of the fixed groove 10 is inlaid with a test base plate 4, and the inner wall of the fixed groo...

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PUM

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Abstract

The present invention discloses an adjustable test bed of nails for a circuit board. The adjustable test bed of nails comprises an adjustable support pedestal; a fixed base plate is fixed at the top end of the adjustable support pedestal; a circular screw thread fixed hole is excavated at the lower surface of the center of the fixed base plate; a fixed groove is excavated at the center of the upper surface of the fixed base plate; the internal portion of the fixed groove is inlaid with a test base plate; the upper surface of the test base plate is welded with test probes; tail ends of the testprobes are connected with an automatic test system by wires; positioning holes are excavated around the fixed base plate at the side of the fixed groove; spring positioning pins are plugged into thepositioning holes; a rigid top plate is plugged into the top ends of the spring positioning pins; and the automatic test system comprises a core controller and a multi-path simulation switch, the output end of the multi-path simulation switch is connected with an AD converter, and the AD converter outputs digital signals to the core controller. The adjustable test bed of nails for a circuit boardcan conveniently perform adjustment, disassembling and assembling, is wide in application range, and can automatically and accurately achieve test operation of a circuit board.

Description

technical field [0001] The invention relates to the field of testing needle beds, in particular to an adjustable testing needle bed for circuit boards. Background technique [0002] The main purpose of microelectronic product testing is to ensure quality during the manufacturing process. Defects in the finished product are discovered only in the final stage of manufacture, or when it is delivered to the user, which will inevitably increase the time and cost of repair. Generally, all faults can be identified in the testing process by using online testing (ICT) technology. In ICT measurement, the probe (Probe) array of the special Bed-of-nails Testing Fixture (Bed-of-nailsTestingFixture) is in contact with the soldering area (TestLands) of the test node on the circuit board (PCB), and uses hundreds of millivolts of voltage and data The milliampere current is used for discrete isolation tests, so as to accurately determine the faults of the installed components such as missin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R1/04
CPCG01R1/04
Inventor 许松高松徐承兵方孝东高准石浩乾徐承翱王鹏王平黄平曹风华
Owner 芜湖欣宏电子科技有限公司
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