Level adjusting device, pressing ring assembly and semiconductor processing equipment

Abstract

The invention provides a level adjusting device, a pressing ring assembly and semiconductor processing equipment. The level adjusting device of the present invention includes a first body and a secondbody. One body of the first body and the second body is provided with a protrusion, and the other body is provided with a recess for accommodating the protrusion. The depth of the recess is smaller than the height of the protrusion such that a part of the protrusion is received in the recess. The first body is connected to a to-be-adjusted member. Through the sliding of a surface where the recessand the protrusion are in contact, the first body can change relative to a degree of inclination of the first body so as to adjust the horizontal degree of the to-be-adjusted member. According to thelevel adjusting device provided by the invention, an adjustment range can be greatly increased, and thus the horizontal adjustment is convenient to realize. The pressing ring assembly of the invention comprises the level adjusting device. The semiconductor processing equipment comprises the pressing ring assembly of the invention.

Description

technical field [0001] The invention belongs to the technical field of semiconductor equipment, and in particular relates to a level adjustment device, a pressure ring assembly and semiconductor processing equipment. Background technique [0002] During semiconductor processing, substrates (especially SOG substrates) are usually fixed mechanically. The mechanical fixing method specifically includes: carrying the substrate by means of a mechanical chuck, and then pressing the edge region of the upper surface of the substrate by means of a pressure ring, so as to realize the fixing of the substrate. In practical applications, in order to ensure the cooling effect of the back helium on the substrate, it is necessary to ensure a certain helium leakage, which means that the pressure ring needs to be kept horizontal when pressing the substrate. [0003] At present, for the level adjustment of the pressure ring, usually adopt Figure 1a with Figure 1b level adjustment device sho...

AI Technical Summary

Problems solved by technology

[0006] One, since the body 41 supports the pressure ring 1, the counterweight ring 2, and the support 3, etc., the deformed material area of ​​the body 41 must bear a certain load. Considering the strength of the parts, the deformed material area cannot be too thin. The allowable deformation of the deformable material area of ​​the main body 41 is very small, which will cause the end of the main body 41 where the top wire 41 is located to have a small amount of oblique deformation, resulting in a small adjustment range for horizontal adjustment

[0007] Its two, because the top of body 41 is load-bearing, therefore, jackscrew 42 must be arranged on the below of body 41, therefore, when adjusting the level of pressure ring 1, it is necessary to operate the screwdriver upside down to adjust jackscrew 5 and screw 4, and it is more positive to operate the screwdriver upside down. Difficult to handle with a screwdriver

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