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Intramode injection molding thin film switch

A technology of membrane switch and in-mold injection molding, which is applied in the field of electronics, can solve problems such as inability to fit complex structural products, high glue requirements, and low product durability, and achieve excellent high temperature and high pressure resistance, simplified production processes, and long service life. prolonged effect

Active Publication Date: 2018-03-13
WUHAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Membrane switches are finally bonded to finished parts with glue, which has high requirements for glue, and cannot be bonded to finished products with complex structures, and the durability of the product is not high

Method used

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  • Intramode injection molding thin film switch

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Embodiment Construction

[0029] The principles and features of the present invention are described below in conjunction with the accompanying drawings, and the examples given are only used to explain the present invention, and are not intended to limit the scope of the present invention.

[0030] Such as figure 1 As shown, an in-mold injection molded membrane switch, the membrane switch 1 includes a conductive circuit layer 110, wherein the conductive circuit layer 110 is located at the bottom of the plastic membrane switch 1, the conductive circuit layer 110 is a flexible circuit board (FPC), and the flexible circuit board Injection molding compound layer 120 is provided on the lower surface of the body, the thickness of injection molding compound layer 120 is 0.2mm, the thickness of flexible circuit board is 0.6mm-0.8mm, and the base material of flexible circuit board is polyimide or polyester film.

[0031] The components on the flexible circuit board are arranged on the lower surface of the flexib...

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Abstract

The invention relates to an intramode injection molding thin film switch. The thin film switch comprises a conductive circuit layer, wherein the conductive circuit layer is positioned at the lowest bottom of the injection molding thin film switch; the conductive circuit layer is a flexible circuit board; an injection molding composite layer is arranged on the lower surface of the flexible circuitboard; one side, far from the injection molding composite layer, of the thin film switch is attached to a concave die of an intramode injection molding die by adopting a method of combining the thin film switch with a finished product; meanwhile, a to-be-attached finished product of the thin film switch is attached to a convex die of the intramode injection molding die; and combination between thethin film switch and the finished product is realized by enabling gum to flow to the formed space between the thin film switch and the finished product so as to finally obtain an injection molding sample. The intramode injection molding thin film switch has the beneficial effects of simplifying the production procedures, lowering cost, bringing convenience to combination with the finish product,enabling the thin film switch and the finished product to be formed in an integrated body through the injection molding process, simplifying process, and achieving high production efficiency and highproduct durability.

Description

technical field [0001] The invention relates to the field of electronic technology, in particular to an in-mold injection molding membrane switch. Background technique [0002] Membrane switches are widely used in various electronic products due to their light and thin volume and very little sound when pressed. Traditional membrane switches generally adopt a three-layer structure, including an upper circuit board, an insulating layer and a lower circuit board. The upper circuit board and the lower circuit board include substrates and printed circuits. Bonding by glue requires many production processes and high cost. Membrane switches are finally bonded to finished parts with glue, which has high requirements for glue, and cannot be bonded to finished products with complex structures, and the durability of the product is not high. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide an in-mold injection molding membr...

Claims

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Application Information

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IPC IPC(8): H01H13/704H01H13/88
CPCH01H13/704H01H13/88
Inventor 王辉柏秋阳冯陈泽芳高成
Owner WUHAN UNIV OF TECH
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