Method and system for wiring detection of separable components

A component and wiring technology, which is applied in the field of wiring inspection of separated components, can solve the problems of time-consuming and laborious, easy to miss inspection, etc., and achieve the effect of avoiding missed inspection and improving inspection efficiency

Inactive Publication Date: 2018-03-23
ZHENGZHOU YUNHAI INFORMATION TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, when the above-mentioned separated components are inspected after the wiring is completed, it is necessary to manually inspect them one by one, which is not only time-consuming and laborious, but also prone to missed inspections
[0003] Therefore, how to improve the inspection efficiency of separated components and avoid the occurrence of missed inspections caused by manual inspections is a technical problem that those skilled in the art need to solve at present.

Method used

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  • Method and system for wiring detection of separable components
  • Method and system for wiring detection of separable components

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Embodiment Construction

[0049] The core of the present invention is to provide a method and system for wiring inspection of separated components, which can improve the inspection efficiency of separated components and avoid the occurrence of missed inspection caused by manual inspection.

[0050] In order to make the above objects, features and advantages of the present invention more clearly understood, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0051] In the following description, specific details are set forth in order to provide a thorough understanding of the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar promotions without departing from the connotation of the present invention. Accordingly, the present invention is not limited by the specific implementations disclosed below.

[0052...

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Abstract

The invention discloses a method and system for wiring detection of separable components. The method includes the steps of screening pin line width information of the target separable component in a preset component information library, extracting the power supply/ground pin line width and signal wire pin line width of the target separable component from the pin line width information of the target separable component, calculating the ratio of the power supply/ground pin line width to the signal wire pin line width of the target separable component, judging whether the ratio meets preset detection conditions or not, and generating a corresponding judgment result. During PCB design, the pin line width information of all the separable components is stored in the component information library, the pin line width information of all the separable components can be directly screened out according to requirements of a user after wiring is completed, subsequent calculation and judgment are automatically conducted, the detection result is obtained, the detection efficiency of the separable components is improved, and the leak detection caused by manual detection is avoided.

Description

technical field [0001] The invention relates to the technical field of cloud computing product design, in particular to a method and system for wiring inspection of separate components. Background technique [0002] In cloud computing products (servers, storage, etc.), there are many up-down resistor-capacitor components on the main board, expansion board, switch board and other boards. In order to facilitate subsequent maintenance and disassembly (during maintenance and disassembly, because The tin at the pin is heated to melt it, so that the components can be removed. For example, the pull-up resistor, the line width of the signal line pin is about 4-5 mil, if the line width of the part of the power pin is pulled up If it is too wide, when the tin at the pin is heated, the heat will be dissipated along the copper foil of the power pin. If the melting point of the tin cannot be reached, the component cannot be disassembled. The same is true for pulling down the component. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F17/50
CPCG06F30/398
Inventor 李艳军
Owner ZHENGZHOU YUNHAI INFORMATION TECH CO LTD
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