Flexible OLED display device and sealing method
A display device and sealing technology, applied in electrical components, electrical solid devices, circuits, etc., can solve the problems of product scrap, glass cannot be peeled off normally, connection instability, etc., to achieve improved stability, improved waterproof and moisture resistance and Product stability, the effect of optimizing the process
Active Publication Date: 2018-03-23
WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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Problems solved by technology
However, there is a risk in applying glue on the back of the chip-on-film (COF) connection, because the thickness of the sealant cannot be applied very thickly, which will cause the sealant to contact the backplane glass, and it will remain on the backplane glass after curing. When laser peeling off the backplane, the glass will not be peeled off normally and the product will be scrapped
[0003] To sum up, in the prior art flexible OLED connection process and sealing process, there are problems that the glass cannot be normally laser peeled off due to glass residue, and the connection is unstable.
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[0029] The following descriptions of the various embodiments refer to the accompanying drawings to illustrate specific embodiments in which the invention may be practiced. The directional terms mentioned in the present invention, such as [top], [bottom], [front], [back], [left], [right], [inside], [outside], [side], etc., are only for reference The orientation of the attached schema. Therefore, the directional terms used are used to illustrate and understand the present invention, but not to limit the present invention. In the figures, structurally similar elements are denoted by the same reference numerals.
[0030] Such as Figure 5 As shown, it is a schematic diagram of the connection terminals and sealing glue of the OLED display device in the prior art. The display device includes: an array substrate 501, a buffer layer 502, and an alignment film 503; wherein, the array substrate 501 is provided with a connection terminal 506 The array substrate 501 is connected to the...
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Abstract
The present invention provides a flexible OLED display device and a sealing method. The device includes a flexible substrate, a chip on film and a connection terminal. The flexible substrate includesa display area and a non-display area, and the non-display area includes a first connection area. The chip on film is disposed at an edge of the flexible substrate in a way of corresponding to the first connection region. The connection terminal is disposed between the flexible substrate and the chip on film for electrically connecting the chip on film and the flexible substrate, wherein the chipon film covers at least part of the non-display area of the flexible substrate, the flexible substrate is further provided with a first sealing area and an recessed area in the cover area, and the first sealing area and the recessed area are sequentially disposed in parallel on a side of the first connection area that is away from the display area. The flexible OLED display device and the sealingmethod solve problems that the glass cannot be properly stripped due to glass sealant residue and the connection is unstable.
Description
technical field [0001] The invention relates to the field of display technology, in particular to a flexible OLED display device and a sealing method. Background technique [0002] AMOLED has the characteristics of high resolution, wide viewing angle, fast response, and self-illumination. In the flexible AMOLED bonding process, in order to prevent the connection terminals from being corroded, a sealing process is often performed after the connection process to protect the connection terminal structure from corrosion while improving the stability of the connection. However, there is a risk in applying glue on the back of the chip-on-film (COF) connection, because the thickness of the sealant cannot be applied very thickly, which will cause the sealant to contact the backplane glass, and it will remain on the backplane glass after curing. When laser stripping the backplane, the glass will not be stripped normally and the product will be scrapped. [0003] To sum up, in the p...
Claims
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Login to View More IPC IPC(8): H01L27/32H01L51/52H01L51/56
CPCH10K59/12H10K50/84H10K71/00
Inventor 许杰
Owner WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD