High-power LED packaging process

Abstract

The invention relates to a high-power LED packaging process, which comprises the following steps: a, a packaging cooling substrate is prepared, an LED lampwick is welded on the packaging cooling substrate, and a first silica gel layer is applied to the packaging cooling substrate; b, a plurality of hemispherical grooves are formed in the first silica gel layer; c, lens silica gel is applied to thehemispherical grooves and extends outside the hemispherical grooves, and spherical lenses are formed; and d, a second silica gel layer is applied to the spherical lens. The high-power LED packaging process adopts the spherical lenses, the technical problem that the lighting brightness of a light source is not concentrated enough can be solved, secondary shaping is not needed, the process is simple, and the cost is reduced. Besides, in comparison with the prior art, applying phosphor to the chip is not needed, and the problems that the quantum efficiency of the phosphor falls due to high temperature, and the brightness is reduced are solved.

Description

technical field [0001] The invention belongs to the field of semiconductor packaging, and in particular relates to a high-power LED packaging process. Background technique [0002] LED has the characteristics of long life, high luminous efficiency, good color rendering, safety and reliability, rich colors and easy maintenance. Under the background of increasingly serious environmental pollution, climate warming and increasingly tense energy sources, semiconductor lighting technology developed based on high-power LEDs has been recognized as one of the most promising high-tech fields in the 21st century. At present, LEDs mostly use GaN-based blue light wicks plus yellow fluorescent light to generate white light to achieve lighting. [0003] However, there are following defects in the prior art: [0004] 1. Since the light emitted by the LED light source is generally distributed in a divergent manner, that is, the Lambertian distribution, this causes the illumination brightne...

AI Technical Summary

Problems solved by technology

Since the chip absorbs the backscattered light, this direct coating method will reduce the light extraction efficiency of the package

In addition, if the phosphor is directly coated on the chip, the high temperature generated by the chip will significantly reduce the quantum efficiency of the phosphor, which will seriously affect the lumen efficiency of the package.

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