Package process of large-power blue-light LED dual-layer structure

Abstract

The invention relates to a package process of a large-power blue-light LED dual-layer structure. The package process comprises the following steps of (a) fabricating a package cooling substrate, welding an LED lamp core on the package cooling substrate, and coating a first silica gel layer on the package cooling substrate; (b) forming a first spherical lens; (c) laminating the first spherical lensin the first silica gel layer; (d) coating a second silica gel layer at an upper part of the first spherical lens, and coating a third silica gel layer on the second silica gel layer; (e) forming a second spherical lens; (f) laminating the first spherical lens in the first silica gel layer; and (g) coating a fourth silica gel layer at an upper part of the second spherical lens, wherein at least one of the second silica gel layer, the third silica gel layer and the fourth silica gel layer is provided with fluorescent power, and the LED lamp core is a ultraviolet lamp core. According to the package process of the large-power blue-light LED dual-layer structure, secondary shaping is not needed, and the process is simple and is low in cost.

Description

technical field [0001] The invention belongs to the field of semiconductor packaging, and in particular relates to a high-power blue LED double-layer structure packaging process. Background technique [0002] In 2014, Japanese scientists Isamu Akasaki, Hiroshi Amano and Japanese-American scientist Shuji Nakamura won the Nobel Prize in Physics for their invention of "high-brightness blue light-emitting diodes". The blue light-emitting diode is a gallium nitride diode. The light-emitting diode is a diode made of compounds containing gallium (Ga), arsenic (As), phosphorus (P), nitrogen (N), etc., and can radiate when electrons and holes recombine It emits visible light, so it can be used to make light-emitting diodes. [0003] However, there are following defects in the prior art: [0004] 1. Since the blue light emitted by the LED light source is generally distributed in a divergent manner, that is, the Lambertian distribution, this causes the illumination brightness of the ...

AI Technical Summary

Problems solved by technology

Since the chip absorbs the backscattered light, this direct coating method will reduce the light extraction efficiency of the package

In addition, if the phosphor is directly coated on the chip, the high temperature generated by the chip will significantly reduce the quantum efficiency of the phosphor, which will seriously affect the lumen efficiency of the package.

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