Large power LED double-layer package structure

Abstract

The invention discloses a large power LED double-layer package structure. The structure comprises a radiating substrate (21), a first package layer (22), a second package layer (24), and a plurality of spherical lenses (23); the first package layer (22) is coated on the radiating substrate (21), at least a part of the spherical lens (23) is embedded in the first package layer (22), and the secondpackage layer (24) is coated on the unembedded part of the spherical lens (23). By adopting the spherical lenses, the large power LED double-layer package structure solves the technical problem that the light source illuminating brightness is not enough in concentration, the secondary shaping is unnecessary, the structure is simple, and the production cost is reduced. Furthermore, an operation ofsmearing fluorescent powder on a chip is unnecessary in comparison with the prior art, the problem that the brightness is reduced since the high temperature causes the quantum efficiency reduction ofthe fluorescent powder is solved.

Description

technical field [0001] The invention belongs to the field of semiconductor packaging, in particular to a high-power LED double-layer packaging structure. Background technique [0002] LED has the characteristics of long life, high luminous efficiency, good color rendering, safety and reliability, rich colors and easy maintenance. At present, LEDs mostly use GaN-based blue light wicks plus yellow fluorescent light to generate white light to achieve lighting. [0003] However, the prior art has the following drawbacks. [0004] 1. Since the light emitted by the LED light source is generally distributed in a divergent manner, that is, the Lambertian distribution, this causes the illumination brightness of the light source to be insufficiently concentrated. The existing silicone lens generally needs to be reshaped by an external lens to meet the lighting requirements of specific occasions. The structure is complicated and the production cost is higher. [0005] 2. In the exis...

AI Technical Summary

Problems solved by technology

Since the chip absorbs the backscattered light, this direct coating method will reduce the light extraction efficiency of the package

In addition, if the phosphor is directly coated on the chip, the high temperature generated by the chip will significantly reduce the quantum efficiency of the phosphor, which will seriously affect the lumen efficiency of the package.

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