High-power LED double-layer structure packaging process

Abstract

The invention relates to a high-power LED double-layer structure packaging process. The process comprises the following steps of a, preparing a packaging heat-dissipation substrate, welding an LED lamp core on the packaging heat-dissipation substrate, and coating a first silica gel layer on the packaging heat-dissipation substrate; b, forming a plurality of first semi-spherical grooves in the first silica gel layer; c, coating the first lens silica gel in the first semi-spherical grooves and extending the first lens silica gel out of the semi-spherical grooves to form a first spherical lens; d, coating a second silica gel layer on the upper portion of the first spherical lens, and coating a third silica gel layer on the second silica gel layer; e, forming a plurality of second semi-spherical grooves in the third silica gel layer; f, coating the second lens silica gel in the plurality of second semi-spherical grooves and extending the second lens silica gel out of the plurality of second semi-spherical grooves to form a second spherical lens; g, coating a fourth silica gel layer on the upper portion of the second spherical lens. According to the invention, the high-power LED double-layer structure packaging process does not need secondary shaping, and is simple in process and low in cost.

Description

technical field [0001] The invention belongs to the field of semiconductor packaging, and in particular relates to a high-power LED double-layer structure packaging process. Background technique [0002] LED (Lighting Emitting Diode) is a light-emitting diode, which is a semiconductor solid-state light-emitting device. It uses a solid semiconductor chip as a light-emitting material. In the semiconductor, the excess energy is released through the recombination of carriers to cause photon emission, and directly emits red, yellow, blue, and green light. On this basis, using the principle of three primary colors, Adding fluorescent powder can emit light of any color. [0003] However, there are following defects in the prior art: [0004] 1. Since the light emitted by the LED light source is generally distributed in a divergent manner, that is, the Lambertian distribution, this causes the illumination brightness of the light source to be insufficiently concentrated. The existi...

AI Technical Summary

Problems solved by technology

Since the chip absorbs the backscattered light, this direct coating method will reduce the light extraction efficiency of the package

In addition, if the phosphor is directly coated on the chip, the high temperature generated by the chip will significantly reduce the quantum efficiency of the phosphor, which will seriously affect the lumen efficiency of the package.

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