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Manufacturing method of glass film and manufacturing method of electronic device including glass film

A manufacturing method and technology of electronic equipment, applied in the direction of electronic equipment, chemical instruments and methods, glass/slag layered products, etc., can solve the problems of increased fixing force, peeling off glass film, etc., and achieve the effect of preventing breakage

Active Publication Date: 2020-07-31
NIPPON ELECTRIC GLASS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the laminated body of the above-mentioned structure is subjected to heat treatment, the fixing force of the supporting glass and the glass film in a state of direct or indirect contact through a resin layer, an inorganic thin film layer, etc. increases, so it is difficult to Problems such as peeling of the glass film from the supporting glass

Method used

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  • Manufacturing method of glass film and manufacturing method of electronic device including glass film
  • Manufacturing method of glass film and manufacturing method of electronic device including glass film
  • Manufacturing method of glass film and manufacturing method of electronic device including glass film

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Embodiment Construction

[0068] Below, refer to Figure 1 to Figure 16 A first embodiment of the method of manufacturing an electronic device including a glass film according to the present invention will be described. It should be noted that, in this embodiment, the following case will be described as an example: when manufacturing an organic EL panel as an electronic device, the organic EL with the support is peeled off by the glass film and the support. The panel is separated into an organic EL panel and a support.

[0069] Such as figure 1 As shown, the method for manufacturing an electronic device according to an embodiment of the present invention includes: a laminated body forming step S1 in which a laminated body including a glass film is formed; a mounting step S2 in which In S2, electronic equipment components are attached to the glass film accompanying the heating of the glass film to form an electronic device with a support; Peel off electronic devices containing glass membranes.

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Abstract

When peeling off the glass film (2) from the support (1), set the first fulcrum (P1) of the support (1) at the corner (4) protruding from the glass film (2) of the support (1) , and a second fulcrum (P2) supporting the laminate (3) is provided at a position separated from the first fulcrum (P1). Furthermore, by providing an external force applying member (18) between the first fulcrum (P1) and the second fulcrum (P2), the point of action of the external force (F) is provided so that the recess (3c) is formed on the side of the support (1) A part of the laminated body (3) is deformed into a concave shape. Then, by inserting a wedge-shaped member (19) between the glass film (2) and the support (1) while a part of the laminate (3) is deformed into a concave shape, the glass film (2) is peeled off from the support (1). )a part of.

Description

technical field [0001] The present invention relates to a method of manufacturing a glass film and a method of manufacturing an electronic device including the glass film, and particularly relates to a technique for peeling the glass film from a support. Background technique [0002] In recent years, from the viewpoint of saving space, flat panel displays such as liquid crystal displays, plasma displays, organic EL displays, and field emission displays have become popular instead of conventionally popular CRT displays. In addition, these flat panel displays have been further thinned. [0003] In particular, in organic EL displays and organic EL lighting, the very small (thin) thickness dimension is utilized to provide a function that can be folded or rolled up. As a result, not only is it easy to carry, but it can also be used in a curved state in addition to the conventional flat state, so it is expected to be flexibly applied to various uses. Therefore, glass substrates ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C03C27/06H01L51/50H05B33/02H05B33/14
CPCC03C27/06H05B33/02H05B33/14B32B3/02B32B3/28B32B7/06B32B17/06B32B43/006B32B2315/08B32B2457/00
Inventor 山崎康夫南贵博飨场久敏冈隆雄藤田崇
Owner NIPPON ELECTRIC GLASS CO LTD
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