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Semiconductor mounting device

A mounting device, semiconductor technology, applied in the direction of semiconductor devices, semiconductor/solid-state device manufacturing, electric solid-state devices, etc., can solve problems such as poor bonding of chip components, deflection, fatigue aging deviation, etc., and achieve the effect of suppressing poor bonding

Inactive Publication Date: 2021-01-26
TORAY ENG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, in the heating and pressing head, variations in the amount of deflection and fatigue aging due to the difference in the time-dependent change of each elastic body may cause bonding failure due to uneven pressing of the chip components.

Method used

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  • Semiconductor mounting device
  • Semiconductor mounting device
  • Semiconductor mounting device

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Experimental program
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Embodiment Construction

[0038] First, use Figure 1 to Figure 5 , the semiconductor mounting apparatus 1 as the first embodiment among the semiconductor mounting apparatuses of the present invention will be described. In the following description, the direction in which the circuit board C is conveyed from the provisional bonding apparatus 2 to the main bonding apparatus 12 is referred to as the X-axis direction, and the direction perpendicular to the X-axis direction is referred to as the Y-axis direction. The tentative bonding head 7 and the main bonding head 17 will describe the moving direction perpendicular to the circuit board C as the Z-axis direction, and the rotating direction around the Z-axis as the θ direction. In addition, in this embodiment, although the temporary bonding apparatus 2 and the main bonding apparatus 12 are comprised separately as the semiconductor mounting apparatus 1, it is not limited to this. In addition, in this embodiment, the non-conductive film (hereinafter abbrev...

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Abstract

The object of the present invention is to provide a semiconductor mounting device capable of grasping the change over time of a pressure head caused by fixing chip components on a circuit board, and suppressing the generation of chips caused by variations in the pressure state caused by the change over time. Parts are poorly joined. Specifically, the semiconductor mounting device (1) has a pressure head, which is a main pressure head, which pressurizes a chip component (D) and fixes it on a predetermined position of a circuit board (C), that is, a position (Pt) where temporary pressure bonding is possible. Welding head (17), according to the position of the formal pressure-bonding head (17) relative to the circuit substrate (C), the position of the chip component (D) that is simultaneously pressurized by the official pressure-bonding head (17) is calculated at this position. Quantity and according to the quantity of described chip parts (D) change the pressurized force of official bonding head (17), that is, the formal bonding load (Fp) and carry out chip parts (D) by formal bonding head (17). Pressurization is performed, and the number of times of pressurization is accumulated, that is, the number of times of pressurization (Np).

Description

technical field [0001] The present invention relates to semiconductor mounting devices. In detail, it is related with the semiconductor mounting apparatus which mounts the chip component etc. which are a semiconductor element on a circuit board. Background technique [0002] Conventionally, there is known a semiconductor mounting device which is configured by a provisional bonding process and a main bonding process in order to cope with high precision and miniaturization of the pattern of a substrate having a circuit composed of a conductor such as copper wiring, Among them, the temporary bonding process uses an adhesive to temporarily fix the chip component composed of a semiconductor element on the pad formed on the circuit board, and the main bonding process bonds the bump of the chip component temporarily fixed on the pad to the pad. . For example, Patent Document 1. In such a semiconductor mounting device, in order to avoid the influence of heat on adjacent chip comp...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/60H05K13/04
CPCH01L2224/75H01L2224/81H01L2224/95H05K13/04H01L21/67121H01L21/67144H01L21/67259
Inventor 朝日昇仁村将次宫本芳范
Owner TORAY ENG CO LTD