A sealed reaction box for industrial production

Abstract

The invention discloses a sealing reaction box for industrial production, which comprises an outer furnace and an inner furnace. The inner furnace is located in the outer furnace, a vacuum layer is arranged between the inner furnace and the outer furnace, the side wall of the outer furnace is provided with a controller, a plurality of outer connecting rods are arranged in the vacuum layer, and oneends of the outer connecting rods are fixed on the outer wall of the inner furnace. By arranging the vacuum layer between the inner furnace and the outer furnace, heat loss is further avoided, and the use rate of heat is improved. Two mutual parallel insertion plates are arranged in a sintering box and the insertion plates are provided with insertion rings, such that a heat tube is prevented frombeing inclined and falling down in the machining process. By arranging two flow separation plates, high temperature gas and cooling gas can slowly enter, the thermal stress damage of metal caused bysudden change of the temperature is avoided, in the design, the entrance of both the high temperature gas and cooling gas can be intelligently adjusted and controlled by the controller, temperature detection is performed by using high heat resistance of a thermocouple, and the intelligent control of the device is finally realized.

Description

technical field [0001] The invention relates to the field of industrial production and manufacturing, in particular to a sealed reaction box for industrial production. Background technique [0002] With the continuous development of microelectronics and optoelectronics in the direction of high performance and high integration, the power consumption of electronic chips is increasing, especially under the development trend of thinner and more compact electronic equipment, the electronic components The problem of heat dissipation is becoming more and more prominent. As a high-efficiency phase change heat transfer element, micro heat pipes have been widely used to solve thermal problems in many fields. However, in order to use micro heat pipes to dissipate heat on compact electronic devices, it is necessary to develop ultra-thin micro heat pipes with thinner thickness, smaller volume and good heat transfer performance. [0003] The processing process of the heat pipe includes ...

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Problems solved by technology

[0003] The processing process of the heat pipe includes pipe cutting, rolling, necking, electric welding, powder filling, sintering, annealing, etc. The sintering process is an important process that affects the quality of the heat pipe. Due to the small thickness of the ultra-thin micro heat pipe wall, conventional When the sintering equipment is processed, the rapid change of temperature will cause the metal to be damaged by thermal stress, and the collision of the tube during the processing will also cause the deformation of the tube wall, which will affect the subsequent processing

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