High-precision non-contact deformation measurement method for component pins

Abstract

The invention discloses a high-precision non-contact deformation test method for a component pin. The method is characterized by comprising the following steps: 1, two laser vibration meters with thesame performance parameters are installed on the same adapter tool, the adapter tool is connected onto a truss, and effective working space is thus provided for measurement by the laser vibration meters; 2, the truss is fixed on the ground through a low-rigidity vibration isolation device, the vibration isolation frequency of the vibration isolation device needs to be ensured below 5 Hz, and thus,and thus, when the component is subjected to a vibration test, the ambient interference produced around is ensured not to affect the test results of the laser vibration meters; and 3, a printed circuit board is fixed on a vibration table through modes such as screw joint, and the vibration table is debugged to enable the dynamic ring of the vibration table to be kept at the balance position before the vibration test. The deformation of any pin can be acquired accurately, and effective basis is provided for optimal design and evaluation and selection of the component.

Description

technical field [0001] The invention relates to a test method, in particular to a high-precision non-contact deformation test method for component pins. Background technique [0002] The vibration reliability of electronic products is currently one of the key points of concern and research in the aerospace industry at home and abroad. According to the statistics of electronic equipment hardware failures by the US Air Force in the past 20 years, about 55% of the failures are related to vibration and Shock-related, at present, the reliability test of electronic products is mainly to test the whole printed circuit board or the whole single machine, obtain the macroscopic response characteristics of the printed circuit board through strain gauges and other means, and then estimate its own reliability as a whole, Although this method is commonly used, when some pins of a certain component are broken in the test, it is impossible to analyze the cause of the break in detail, and th...

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Problems solved by technology

[0002] The vibration reliability of electronic products is currently one of the key points of concern and research in the aerospace industry at home and abroad. According to the statistics of electronic equipment hardware failures by the US Air Force in the past 20 years, about 55% of the failures are related to vibration and Shock-related, at present, the reliability test of electronic products is mainly to test the whole printed circuit board or the whole single machine, obtain the macroscopic response characteristics of the printed circuit board through strain gauges and other means, and then estimate its own reliability as a whole, Although this method is commonly used, when some pins of a certain component are broken in the test, it is impossible to analyze the cause of the break in detail, and the margin of other unbroken components and their pins cannot be analyzed. Given clear quantitative data, this leads to the following deficiencies: 1. Since the pins of the components are very small, and when the pins break, the fracture position is basically at the connection between the pins and the components. Therefore, the existing The test method cannot quantitatively obtain the deformation at the time of fracture. Second, the frequency range of the vibration test is usually wide, while the existing test method usually has a narrow response range to the frequency, which has an impact on the accuracy of the test data.

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