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Polishing-caused quartz crystal wafer surface shallow scratch visual detection method

A technology for visual inspection of quartz wafers, applied in image data processing, instruments, calculations, etc., can solve the problem that shallow scratches on the surface of quartz wafers cannot be completely detected, and achieve the effect of inspection quality assurance

Inactive Publication Date: 2018-04-20
RES INST OF ZHEJIANG UNIV TAIZHOU
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The purpose of the present invention is to solve the technical problem that shallow scratches on the surface of quartz wafers cannot be completely detected by using a single-channel light source

Method used

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  • Polishing-caused quartz crystal wafer surface shallow scratch visual detection method
  • Polishing-caused quartz crystal wafer surface shallow scratch visual detection method
  • Polishing-caused quartz crystal wafer surface shallow scratch visual detection method

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Embodiment Construction

[0029] Before describing the embodiments in detail, it should be understood that the present invention is not limited to the detailed structures or arrangements of elements described herein below or in the accompanying drawings. The present invention can be implemented in other ways. Also, it should be understood that the phraseology and terminology used herein are for descriptive purposes only and should not be interpreted as limiting. The terms "including", "comprising", "having" and similar expressions used herein are meant to include the items listed thereafter, their equivalents and other additional items. In particular, when "a certain element" is described, the present invention does not limit the number of the element to one, but may also include a plurality.

[0030] like Figure 1-3 Shown, the visual inspection method of the shallow scratch that originates from the quartz wafer surface of polishing of the present invention, comprises the following steps:

[0031] ...

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Abstract

The invention discloses a polishing-caused quartz crystal wafer surface shallow scratch visual detection method. The method comprises the following steps: 1) placing a quartz crystal wafer onto a glass disc; 2) adopting upper and lower two industrial cameras to focus on the upper and lower surfaces of the quartz crystal wafer respectively; 3) arranging eight 0-angle light sources around the quartzcrystal wafer uniformly with the quartz crystal wafer being the center of a circle; 4) controlling the eight 0-angle light sources to lighten up in sequence, and each time one 0-angle light source islightened up, triggering the upper and lower two industrial cameras to collect a frame of image simultaneously, and enabling the upper and lower two industrial cameras to collect eight frames of images respectively; 5) carrying out processing on the 16 frames of images through an mage processing algorithm, and in the image processing result, if detecting a scratch on one frame of image, judging that the quartz crystal wafer has the scratch, or otherwise, judging that the quartz crystal wafer has no scratch. The method can ensure the detection quality.

Description

technical field [0001] The invention relates to a visual inspection method for shallow scratches on the surface of a polished quartz wafer. Background technique [0002] During the grinding and polishing process of quartz wafers, shallow scratches that cannot be detected by the naked eye will be formed on the surface, and shallow scratches need to be detected by certain detection means. [0003] If a single light source is used to irradiate the surface of the quartz wafer, even if the light coverage of the light source is large, the light source light will be uneven in strength, and some shallow scratches on the surface of the quartz wafer will not be fully displayed, so the detection cannot be guaranteed. quality. Contents of the invention [0004] The purpose of the invention is to solve the technical problem that the shallow scratches on the surface of the quartz wafer cannot be completely detected by using a single-channel light source at present. [0005] In order t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06T7/00G06T7/136G06T7/181
Inventor 林晨宽陈浙泊余建安
Owner RES INST OF ZHEJIANG UNIV TAIZHOU
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