Heat radiation pad for electronic products
A technology for electronic products and heat dissipation pads, which is applied in the field of heat dissipation pads for electronic products, can solve the problems of low flexibility, difficulty in changing fixed structures, poor versatility, etc., and achieve the effect of high versatility
Inactive Publication Date: 2018-04-20
TAIZHOU KELUOMIDE MACHINERY EQUIMENT CO LTD
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[0016] In order to deepen the understanding of the present invention, the present invention will be further described below in conjunction with the embodiments and accompanying drawings. The embodiments are only used to explain the present invention and do not constitute a limitation to the protection scope of the present invention.
[0017] Such as figure 1 and figure 2 The shown heat dissipation pad for electronic products includes a heat dissipation pad body 1 and a heat dissipation pad monomer 2. The heat dissipation pad body 1 is assembled from a number of heat dissipation pad monomers 2, and a number of heat dissipation pads are provided in the middle of a single heat dissipation pad monomer 2. The holes 3 and the edges of the cooling pad monomer 2 are provided with edge banding 4 , and the edge banding 4 is provided with buckles 8 , and several cooling pad monomers 2 are connected or separated by the buckle 8 .
[0018] In this embodiment, the buckle 8 includes a lock...
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The invention discloses a heat radiation pad for electronic products. The heat radiation pad for electronic products includes a heat radiation pad main body and heat radiation pad monomers, wherein the heat radiation pad main body is formed through assembling of a plurality of heat radiation pad monomers; the central section of the single heat radiation pad monomer is provided with a plurality ofradiating holes; an edge sealing is arranged at the edge of the each heat radiation pad monomer; buckles are arranged at the edge sealing; and every two of the plurality of heat radiation pad monomersare connected or separated through the buckles. As the heat radiation pad main body employs the mode of monomer combination, different number of monomers can be used to assemble the heat radiation pad main body according to the practical demand, so that the heat radiation pad for electronic products is high in universality, can realize detachable connection through the buckles, and is quick and convenient. Besides, as the buckles are arranged in a hinged manner, the heat radiation pad for electronic products can be stored only through folding, so that the heat radiation pad for electronic products is convenient and practical.
Description
technical field [0001] The invention relates to the technical field of heat dissipation of electronic products, in particular to a heat dissipation pad for electronic products. Background technique [0002] Electronic products will generate heat during use, reducing their service life. Therefore, it is necessary to dissipate heat for electronic products that are prone to heat. Due to the advantages of good heat sink effect and low cost, installing heat sinks has become the first choice for heat dissipation of existing electronic products. Program. However, most of the existing heat sinks are made of aluminum alloy or copper into plates or flakes, the structure is fixed and difficult to change, the flexibility is low, and it is difficult to adapt to products of different specifications and sizes, and the versatility is poor. [0003] Therefore, in order to solve the above-mentioned existing problems, the present invention provides a new technical solution. Contents of the ...
Claims
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IPC IPC(8): H05K7/20
CPCH05K7/2039
Inventor 王煜
Owner TAIZHOU KELUOMIDE MACHINERY EQUIMENT CO LTD