Automatic crimping mechanism and automatic crimping device
A mobile mechanism, automatic technology, applied in the direction of measuring devices, machine/structural parts testing, instruments, etc., can solve the problems of inaccurate automatic alignment and crimping, incomplete function realization, etc., to save labor costs, improve production efficiency, The effect of precise alignment and crimping
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Embodiment 1
[0029] Such as figure 2 As shown, this embodiment provides an automatic crimping mechanism for panel point screen detection, including a moving mechanism 11, an indenter module 12 and an image system 13; the indenter module 12 is fixed on the moving mechanism 11 Above, as the moving mechanism 11 moves, the imaging system 13 is arranged above the indenter module 12, and the indenter module 12 and the imaging system 13 can move with the moving mechanism 11; The image system 13 obtains the relative position of the indenter 122 of the indenter module 12 and the panel test pad through the camera 131, and the indenter module 12 is used to connect the flexible circuit board 20 connecting the test signal to the panel The test pad is crimped.
[0030] The flexible circuit board 20 is driven to move by the moving mechanism. At the same time, the image system is used to collect and judge whether the positions of the test pad and the flexible circuit board 20 are aligned in real time. ...
Embodiment 2
[0040] The difference between this embodiment and embodiment one is:
[0041] Such as image 3 As shown, there is a transparent part 1212 on the crimping platform 121, and a bearing groove 1213 is provided under the transparent part, and a backlight 1211 is installed in the bearing groove 1213 for assisting the imaging system 13 to take pictures.
[0042] The backlight 1211 enables the imaging system 13 to take pictures more clearly, thereby improving the accuracy of the imaging system 13 in judging the positions of the flexible circuit board 20 and the test pad, and avoiding misjudgment and misalignment of the two.
Embodiment 3
[0044] The difference between this embodiment and embodiment one is:
[0045] An air blowing system 14 is also included, the air blowing system 14 is slidably connected to the moving mechanism 11 and located above the crimping platform 121 for blowing air to the crimping platform 121 . The wind pressure forces the flexible circuit board 20 and the test pad to be flattened on the crimping platform, thereby improving the accuracy of the imaging system in judging the position of the flexible circuit board 20 and the test pad, and avoiding problems caused by warping or unevenness of the flexible circuit board 20 and the test pad. The occurrence of the problem of inaccurate judgment of its position.
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