Composite support heat radiation structure of portable electronic device

Abstract

Provided is a composite support heat radiation structure of a portable electronic device, comprising a front housing and a rear housing, which are suitable for a portable electronic device. The fronthousing and the rear housing are combined into an assembly in a corresponding manner. The front housing and the rear housing of the assembly are at least provided with a composite material composed oftwo or more layers of different rigid materials through integral forming. The composite material undergoes stamping forming and is placed into a die, forming an integral body having a frame, which isthe main support body of the front housing and the rear housing. A composite support heat radiation structure is formed, and the front housing is corresponding to the rear housing, forming a heat radiating system. The invention is advantageous in that composite material is used for heat radiation, the problem that a machine body of the portable electronic device gets hot or breaks down after long-time usage can be prevented due to the fact that heat radiated by the heat source of the electronic assembly is evenly scattered in the integral cavity through the composite support heat radiation structure, and after heat exchange with the external world, the temperature of the portable electronic device will be obviously reduced compared with the core temperature of the electronic device; the performance of the electronic device can be relatively and completely developed, and better man-machine experience for consumers can be provided.

Description

technical field [0001] The invention relates to a composite supporting heat dissipation structure of a portable electronic device. The composite supporting heat dissipation structure is applied to a portable electronic device, so that the portable electronic device can solve the problem of the body being hot or crashed, and relatively can fully utilize the electronic device. performance, so that consumers have a better man-machine experience. Background technique [0002] The currently commercially available portable electronic devices, after a long period of use, may overheat locally. This phenomenon not only causes the performance of the electronic device to degrade, but also causes the body to become hot or crash. [0003] Secondly, since the appearance of portable electronic devices requires too thin thickness, there is no space reserved for heat convection in traditional heat transfer methods (using fans to obtain convection), so only heat conduction and heat radiation ...

AI Technical Summary

Problems solved by technology

[0002] At present, the portable electronic devices on the market will overheat locally after long-term use. This phenomenon not only reduces the performance of the electronic equipment, but also causes the body to become hot or crash.

[0003] Secondly, since the appearance of portable electronic devices requires too thin thickness, there is no space reserved for heat convection in traditional heat transfer methods (using fans to obtain convection), so only heat conduction and heat radiation are left. It can be applied. At present, most of the portable electronic devices on the market are attached near the heat source, such as graphite sheet, copper foil and other high-composite materials to achieve the purpose of heat dissipation and cooling. From the commercially available Meizu, Xiaomi, Huawei and other brands of large-screen mobile phones From the point of view, there is no significant heat dissipation and cooling effect, and the local temperature is still high. This phenomenon not only causes the performance of electronic equipment to decrease, the body becomes hot or crashes, and even makes consumers feel that the temperature is too high or even burns the user. Consumers often use it have complaints

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