Composite support heat radiation structure of portable electronic device

A composite support, electronic device technology, applied in the direction of modification, cooling/ventilation/heating transformation through conduction heat transfer, etc., can solve the problems of high touch temperature for consumers, hot body, no space reserved for heat convection, etc. Overcome the effect of maximum heat dissipation area and good human-machine experience

Active Publication Date: 2018-05-01
SHENZHEN WEALTHY HIGH TECH MATERIAL CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, the portable electronic devices on the market will overheat locally after long-term use. This phenomenon not only reduces the performance of the electronic equipment, but also causes the body to become hot or crash.
[0003] Secondly, since the appearance of portable electronic devices requires too thin thickness, there is no space reserved for heat convection in traditional heat transfer methods (using fans to obtain convection), so only heat conduction and heat radiation are left. It can be applied. At present, most of the portable electronic devices on the market are attached near the

Method used

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  • Composite support heat radiation structure of portable electronic device
  • Composite support heat radiation structure of portable electronic device
  • Composite support heat radiation structure of portable electronic device

Examples

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Example Embodiment

[0038] First, see Figure 1 ~ Figure 3 and Figure 4A , Figure 4B As shown, a preferred embodiment of a composite supporting heat dissipation structure for a portable electronic device of the present invention includes: a front shell 111 and a rear shell 112 suitable for the portable electronic device 10, and the front shell 111 and the rear shell 112 Correspondingly combined into a component 11, the feature is that the front shell 111 and the rear shell 112 on the component 11 are at least integrally formed with a composite material 21 composed of two or more layers of different rigid materials 211, 212, The composite material 21 is stamped and formed and then placed in a mold (plastic mold or die-casting mold), and then molded into a complete body with a frame (plastic or metal) to make it the main support of the front shell 111 and the rear shell 112 The body forms a composite supporting heat dissipation structure 20, so that the front shell 111 and the rear shell 112 corre...

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Abstract

Provided is a composite support heat radiation structure of a portable electronic device, comprising a front housing and a rear housing, which are suitable for a portable electronic device. The fronthousing and the rear housing are combined into an assembly in a corresponding manner. The front housing and the rear housing of the assembly are at least provided with a composite material composed oftwo or more layers of different rigid materials through integral forming. The composite material undergoes stamping forming and is placed into a die, forming an integral body having a frame, which isthe main support body of the front housing and the rear housing. A composite support heat radiation structure is formed, and the front housing is corresponding to the rear housing, forming a heat radiating system. The invention is advantageous in that composite material is used for heat radiation, the problem that a machine body of the portable electronic device gets hot or breaks down after long-time usage can be prevented due to the fact that heat radiated by the heat source of the electronic assembly is evenly scattered in the integral cavity through the composite support heat radiation structure, and after heat exchange with the external world, the temperature of the portable electronic device will be obviously reduced compared with the core temperature of the electronic device; the performance of the electronic device can be relatively and completely developed, and better man-machine experience for consumers can be provided.

Description

technical field [0001] The invention relates to a composite supporting heat dissipation structure of a portable electronic device. The composite supporting heat dissipation structure is applied to a portable electronic device, so that the portable electronic device can solve the problem of the body being hot or crashed, and relatively can fully utilize the electronic device. performance, so that consumers have a better man-machine experience. Background technique [0002] The currently commercially available portable electronic devices, after a long period of use, may overheat locally. This phenomenon not only causes the performance of the electronic device to degrade, but also causes the body to become hot or crash. [0003] Secondly, since the appearance of portable electronic devices requires too thin thickness, there is no space reserved for heat convection in traditional heat transfer methods (using fans to obtain convection), so only heat conduction and heat radiation ...

Claims

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Application Information

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IPC IPC(8): H05K7/20
CPCH05K7/2039
Inventor 杨翔宇谢裕杰陈宥嘉周进义
Owner SHENZHEN WEALTHY HIGH TECH MATERIAL CORP
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