An in-mold injection molding heat dissipation coating structure capable of carrying an electronic device

A technology for heat-dissipating coatings and electronic devices, which is used in electrical equipment structural parts, electrical components, cooling/ventilation/heating renovation, etc. Good quality, good human-machine experience, and the effect of solving heat dissipation problems

Pending Publication Date: 2019-01-15
SHENZHEN WEALTHY HIGH TECH MATERIAL CORP
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it is found that the heat dissipation coating is made on the casing by means of electroplating, coating or spraying. In addition to the problem of sticking the upper cover with adhesive, the manufacturing process is complicated, environmental protection problems, yield problems, and cost problems. Therefore, it is not perfect, so there is still room for improvement

Method used

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  • An in-mold injection molding heat dissipation coating structure capable of carrying an electronic device
  • An in-mold injection molding heat dissipation coating structure capable of carrying an electronic device
  • An in-mold injection molding heat dissipation coating structure capable of carrying an electronic device

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Embodiment Construction

[0047] First, see Figure 2 to Figure 8 As shown, the in-mold injection-molded heat dissipation coating structure of the portable electronic device 10A of the present invention includes a rear case 11 combined with a front case 12, and the front case 12 and the rear case 11 are combined into a component 19 correspondingly, and in The rear shell 11 and the cavity 18 of the front shell 12, and the top surface of the front shell 12 are provided with predetermined electronic components, in this embodiment, the electronic components include the rear shell 11 and the front shell 12 Between the circuit board 13 and the battery 15 , the circuit board 13 has a core component 14 , and the electronic assembly also includes a display module 16 and a touch panel 17 disposed on the top surface of the front case 12 . However, the above-mentioned structure is the main component of the portable electronic device, which belongs to the prior art (Prior Art), which is not the purpose of this pate...

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Abstract

An in-mold injection molding heat dissipation coating structure capable of carrying an electronic device, includes a front housing and a rear housing adapted for a portable electronic device, characterized in that: the front shell and the rear shell are respectively injection molded in a cavity of a plastic injection mold, A heat dissipation coating structure is transferred directly to the injection molding, so as to achieve the maximum effective heat dissipation area, The heat dissipated from the chip heat source is evenly distributed in the whole cavity through the heat dissipation coating structure, and the heat exchange with the outside world is definitely reduced relative to the core temperature, which does not cause the airframe to be hot or crash problem, and relatively can give full play to the performance of the electronic equipment, so that consumers can have a better man-machine experience.

Description

technical field [0001] The invention relates to a heat dissipation coating structure of a portable electronic device, especially a heat dissipation coating structure injection molded in a plastic mold. Background technique [0002] The currently commercially available portable electronic devices, after a long period of use, may overheat locally. This phenomenon not only causes the performance of the electronic device to degrade, but also causes the body to become hot or crash. [0003] Secondly, since the appearance of portable electronic devices requires too thin thickness, there is no space reserved for heat convection in traditional heat transfer methods (using fans to obtain convection), so only "heat conduction" and "heat radiation" are left. "Two methods can be applied. Most of the portable electronic devices currently available on the market are attached near the heat source, such as graphite sheet, copper foil and other high thermal conductivity materials to achieve ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20B29C45/14
CPCH05K7/20472B29C45/14
Inventor 杨韻蓁余冬香陈宥嘉
Owner SHENZHEN WEALTHY HIGH TECH MATERIAL CORP
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