Composite supporting heat dissipation structure for portable electronic devices

Abstract

A composite supporting heat dissipation structure for a portable electronic device, comprising: a front case and a rear case suitable for a portable electronic device, and the front case and the rear case are correspondingly combined into a component, and the front case and the rear case on the component, At least one-piece molding is provided with a composite material composed of two or more layers of different rigid materials. After the composite material is stamped and formed, it is placed in a mold, and the mold is injected into a complete body with a frame to become the main body of the front shell and the rear shell. The supporting body forms a composite supporting heat dissipation structure, so that the front shell and the rear shell correspond to form a heat dissipation system. The composite material is used to dissipate heat. After the portable electronic device is used for a long time, the heat emitted by the heat source of the electronic component is evenly distributed in the entire cavity through the composite support heat dissipation structure, and then the heat exchange with the outside world has a clear relative to the core temperature of the electronic device. It will not cause the body to overheat or crash, and it can give full play to the performance of electronic equipment, so that consumers can have a better human-machine experience.

Description

technical field [0001] The invention relates to a composite supporting heat dissipation structure of a portable electronic device. The composite supporting heat dissipation structure is applied to a portable electronic device, so that the portable electronic device can solve the problem of the body being hot or crashed, and relatively can fully utilize the electronic device. performance, so that consumers have a better man-machine experience. Background technique [0002] The currently commercially available portable electronic devices, after a long period of use, may overheat locally. This phenomenon not only causes the performance of the electronic device to degrade, but also causes the body to become hot or crash. [0003] Secondly, since the appearance of portable electronic devices requires too thin thickness, there is no space reserved for heat convection in traditional heat transfer methods (using fans to obtain convection), so only heat conduction and heat radiation ...

AI Technical Summary

Problems solved by technology

[0002] At present, the portable electronic devices on the market will overheat locally after long-term use. This phenomenon not only reduces the performance of the electronic equipment, but also causes the body to become hot or crash.

[0003] Secondly, since the appearance of portable electronic devices requires too thin thickness, there is no space reserved for heat convection in traditional heat transfer methods (using fans to obtain convection), so only heat conduction and heat radiation are left. It can be applied. At present, most of the portable electronic devices on the market are attached near the heat source, such as graphite sheet, copper foil and other high-composite materials to achieve the purpose of heat dissipation and cooling. From the commercially available Meizu, Xiaomi, Huawei and other brands of large-screen mobile phones From the point of view, there is no significant heat dissipation and cooling effect, and the local temperature is still high. This phenomenon not only causes the performance of electronic equipment to decrease, the body becomes hot or crashes, and even makes consumers feel that the temperature is too high or even burns the user. Consumers often use it have complaints

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