16-pin high density integrated circuit package structure

Abstract

The invention discloses a 16-pin high density integrated circuit package structure. The 16-pin high density integrated circuit package structure comprises a top middle rod, an auxiliary pin, a protrusion part, a model mark, a plastic body side surface, a pin, a plastic body front side, a fixing base plate, a heat dissipation plate, a heat dissipation system, a bearing seat, an extending plate, aninstallation hole, an integrated circuit chip, a heat dissipation base plate, a first soldering tin, a power chip, a resistance, a driving chip, a lead frame, a binding wire and resin. The 16-pin highdensity integrated circuit package structure has the advantages that the integrated circuit chip is installed in the installation hole of the bearing base, a rear bearing seat is abutted against theside wall of the integrated circuit chip, therefore the heat generated by the integrated circuit chip is transferred out to achieve heat dissipation. Meanwhile, a heat dissipation hole and a heat dissipation through hole do not block a heat dissipation channel of a heat dissipation frame body, and accordingly air circulation and high-efficiency heat dissipation are achieved.

Description

technical field [0001] The invention relates to a 16-pin high-density integrated circuit packaging structure, which belongs to the field of integrated circuit packaging. Background technique [0002] The packaging types of integrated circuits can be summarized into two categories: hermetic ceramic packaging and plastic packaging. A hermetic ceramic package is a package that uses a vacuum sealing device to isolate the chip from the surrounding enclosure. Typical hermetic ceramic packages are used in high-performance packaging grades. The plastic packaged chip uses epoxy resin to package the chip, and it is difficult to completely isolate the chip from the environment. Therefore, the surrounding air may pass through the package and adversely affect the quality of the chip during the process. This year, plastic packaging technology has been significantly developed in its application and efficacy, and the production process of plastic packaging can be automated, thereby effecti...

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Problems solved by technology

[0004] In view of the deficiencies in the prior art, the purpose of the present invention is to provide a 16-pin high-density integrated circuit packaging structure to solve the problem of heat dissipation on the packaging structure due to higher heat generated by high-efficiency integrated circuit components in the existing packaging structure. The heat dissipation effect of the structure is not ideal

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