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A kind of high thermal conductivity polyimide composite material and preparation method thereof
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A composite material and polyimide technology, which is applied in the field of high thermal conductivity polyimide composite material and its preparation, can solve the problems of poor thermal conductivity and low thermal conductivity of polyimide resin, so as to improve the thermal conductivity and improve the Effect of improving thermal conductivity and thermal conductivity
Active Publication Date: 2020-02-18
CHANGSHA ADVANCED MATERIALS IND RES INST CO LTD
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Problems solved by technology
[0004] The technical problem solved by the present invention is that the thermal conductivity of polyimide resin is low, and after being made into polyimide composite material, the thermal conductivity is poor
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Embodiment 1
[0022] A polyimide composite material with high thermal conductivity, its components are as follows: polyimide resin: 50 parts, carbon fiber after surface treatment: 30 parts, copper-plated carbon nanotube: 10 parts, graphene: 10 parts.
[0023] Carbon fiber surface coupling treatment: Dilute the silane KH-550 coupling agent to a concentration of 20%, add carbon fiber, ultrasonically vibrate for 15 minutes, suction filter, and dry.
[0024] Carbon nanotube copper plating treatment: in SnCl 2 The surface of carbon nanotubes was sensitized in solution for 30 minutes, and then in PdCl 2 The activation treatment was carried out in the solution for 30 minutes, and finally the copper plating treatment was carried out in a commercially available chemical copper plating solution. Cleaning and drying the copper-plated carbon nanotubes.
[0025] Pretreatment of polyimide resin: drying in a vacuum oven at 150° C. for 4 hours.
[0028] A high thermal conductivity polyimide composite material, the preparation method is the same as that of Example 1, and the content of each component is different. Its components are as follows: polyimide resin: 85 parts, surface-treated carbon fiber: 9 parts, copper-coated carbon nanotube: 3 parts, graphene: 3 parts.
Embodiment 3
[0030] A high thermal conductivity polyimide composite material, the preparation method is the same as that of Example 1, and the content of each component is different. Its components are as follows: polyimide resin: 80 parts, surface-treated carbon fiber: 5 parts, copper-coated carbon nanotube: 10 parts, graphene: 5 parts.
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Abstract
The invention discloses a high thermal conductivity polyimide composite material and a preparation method thereof. According to weight percentage, the raw material of the composite material includes the following components: polyimide resin: 50-85%; modified carbon fiber: 5-30%; carbon nanotubes: 3-10%; graphene: 3-10%; the carbon nanotubes are copper-plated carbon nanotubes; the modified carbon fibers are carbon fibers modified by a coupling agent. The high thermal conductivity polyimide composite material prepared by the invention significantly improves the thermal conductivity while fully maintaining the mechanical properties of the polyimide. Compared with the high thermal conductivity polyimide composite material prepared by adopting the invention and the high thermal conductivity polyimide composite material prepared by the untreated filler, the thermal conductivity rate is increased by 40%-60%.
Description
technical field [0001] The invention relates to a high thermal conductivity polyimide composite material and a preparation method thereof, belonging to the field of polyimide composite materials. Background technique [0002] Polyimide is a class of polymer materials containing imide rings in the main chain. Due to the stable aromatic heterocyclic structure in the main chain, it exhibits excellent performance unmatched by other polymer materials. As an advanced composite material matrix, it has outstanding temperature resistance and excellent mechanical properties, and is currently one of the materials with the highest temperature resistance among resin-based composite materials. [0003] Due to its excellent flame retardancy and temperature resistance, polyimide is widely used in aerospace, medical, electronics and other fields. However, the thermal conductivity of polyimide is only 0.2W / m K, which cannot be well applied to fields with high heat dissipation requirements, ...
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