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Automatic identification early-warning system for no-copper area of multilayer circuit board

A multi-layer circuit, automatic identification technology, applied in the direction of printed circuit testing, electronic circuit testing, etc., can solve the problems such as low sensitivity of glue shortage risk warning, inability to calculate size, and error in glue shortage risk warning.

Active Publication Date: 2018-05-08
DALIAN CHONGDA CIRCUIT
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Problems solved by technology

[0004] The above existing methods have the following defects: 1) When the shape of the copper-free area is irregular, the accurate size calculation of the area cannot be performed, resulting in an error in the early warning of the risk of glue shortage; 2) Under the copper-free area of ​​the same size, the multi-layer inner layer The cumulative copper thickness of the plate under the copper-free area has a great influence on the risk of glue shortage. Ignoring the cumulative copper thickness will lead to low sensitivity of glue shortage risk warning

Method used

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  • Automatic identification early-warning system for no-copper area of multilayer circuit board
  • Automatic identification early-warning system for no-copper area of multilayer circuit board

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Embodiment Construction

[0017] The specific embodiment of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0018] It should be noted that, in the following specific embodiments, when describing the embodiments of the present invention in detail, in order to clearly show the structure of the present invention for the convenience of description, the structures in the drawings are not drawn according to the general scale, and are drawn Partial magnification, deformation and simplification are included, therefore, it should be avoided to be interpreted as a limitation of the present invention.

[0019] In the following specific embodiments of the present invention, please refer to figure 1 and figure 2 . An automatic identification and early warning system for copper-free areas of multilayer circuit boards, including a layer unit division module, a layer unit local residual copper rate calculation module, a board unit cumulative copper th...

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Abstract

The invention discloses an automatic identification early-warning system for a no-copper area of a multilayer circuit board. The system comprises a layer unit dividing module, a layer unit copper remaining rate calculating module, a board unit accumulated copper thickness calculating module, a board unit glue shortage risk determining module and an output module. The automatic identification early-warning system has advantages of performing more accurate pre-estimation on a glue shortage risk of the circuit board, grading defect conditions so as to take corresponding measures, and greatly reducing the glue shortage risk in a printed circuit board pressing process.

Description

technical field [0001] The invention relates to the field of printed circuit board manufacturing, and more specifically relates to an automatic identification and early warning system for copper-free areas of multilayer circuit boards. Background technique [0002] In the lamination process of multilayer / high multilayer printed circuit boards, the lack of glue and scrapping is a major problem faced by the lamination process. One of the causes of abnormal glue shortage is the difference in the cumulative copper thickness of the inner copper-free area design. Large, the local pressure in the copper-free area is too small, and the resin flow and bonding are poor. [0003] At present, the industry's solution to the above problems is: in the design of the inner copper-free area, use the defined size of the copper-free area to warn of the risk of glue shortage circuit boards, that is, when the size of the copper-free area exceeds the defined size, for example, when the copper-free...

Claims

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Application Information

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IPC IPC(8): G01R31/28
CPCG01R31/2805
Inventor 马东辉
Owner DALIAN CHONGDA CIRCUIT
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