33results about How to "Reduce risk of defects" patented technology

The invention discloses a pre-oxidation method of a semiconductor packaging and routing surface and a pre-oxidation layer structure thereof. The pre-oxidation method comprises the following steps of: providing a lead and a routing joint surface, wherein one end of the lead is welded and combined to the routing joint surface to form a routing and combining part; providing an oxidizing gas for the routing and combining part to ensure that a pre-oxidation layer is formed on the routing joint surface on the routing and combining part and/or the surface of the lead; and packaging the lead, the routing joint surface, the pre-oxidation layer and the routing and combining part by utilizing a sealing glue material. Because the routing joint surface and/or the surface of the lead have/has the pre-oxidation layer, when the packaging procedure is carried out, the pre-oxidation layer can prevent the lead and/or the routing joint surface from being corroded, so that the risk of generating oxidation defects in the packaging procedure can be reduced so as to improve the welding quality of the routing and combining part and effectively improve the yield of semiconductor packaging.

A device (10) for the tensioning of a leno thread (2, 3) for a doup heddle device (11) can be positioned in proximity to the doup heddle device (11 ), wherein the device (10) comprises for at least one leno thread (2, 3) a resiliency mounted thread guide (20) which forms a bending point (21) for the leno thread (2, 3), wherein the device (10) also comprises a fixedly mountable thread guide (30) which forms a bending point (31) for the leno thread (2, 3) which in use is positioned in proximity to the doup heddle device (11). A weaving machine which comprises a device (10).

The invention discloses an automatic identification early-warning system for a no-copper area of a multilayer circuit board. The system comprises a layer unit dividing module, a layer unit copper remaining rate calculating module, a board unit accumulated copper thickness calculating module, a board unit glue shortage risk determining module and an output module. The automatic identification early-warning system has advantages of performing more accurate pre-estimation on a glue shortage risk of the circuit board, grading defect conditions so as to take corresponding measures, and greatly reducing the glue shortage risk in a printed circuit board pressing process.

The invention discloses an optical proximity correction method for a corner-to-corner structure in a layout. The optical proximity correction method comprises the following steps: S1, finding out an original pattern of an ion implantation layer photoetching layout, wherein the original graph is a graph of a corner-to-corner structure; S2, cutting off a corner at each of the original corners of the original graph, and obtaining a corner part with a notch; S3, on the basis of the pattern in the step S2, carrying out the correction processing to obtain a target pattern structure, wherein notches are formed in the corners of the target pattern, and protrusions are formed on the two adjacent corner edges of the corners of the target pattern; S4, performing model-based adjacent optical effect correction on the target graph to obtain a simulated photoresist contour line.

The invention discloses an electronic element, a plastic coating technology of a microswitch with a resistor and the microswitch with the resistor. According to the plastic coating technology, plasticcoating production is performed for the electronic element in a sequential low-temperature low-pressure and high-temperature high-pressure injection molding plastic coating mode, wherein low-temperature low-pressure plastic coating is performed in advance for protection so that the internal structure of the electronic element can be effectively kept stable in the plastic coating process, the phenomena of displacement, falling and the like in the subsequent assembly process are prevented, and then high-temperature high-pressure plastic coating is carried out to improve the vibration resistance, impact resistance and waterproof capability of the electronic element; based on the plastic coating technology, in the production of the microswitch with the resistor, the microswitch with the resistor with good vibration resistance, impact resistance and waterproofness can be produced, the resistor is protected through low-temperature low-pressure plastic coating in advance, the resistor can beeffectively prevented from displacement, falling off and the like in the subsequent assembly process, the internal structure of the microswitch with the resistor can be effectively kept stable, and the product quality stability is greatly improved.

The invention relates to a method for manufacturing a piezoelectric layer. The method comprises: depositing a piezoelectric material of a first crystalline phase onto a substrate by physical vapor deposition while maintaining the substrate at a temperature below 400 DEG C; and thermally annealing the substrate at a temperature above 500 DEG C to convert the piezoelectric material into a second crystalline phase. The physical vapor deposition comprises sputtering from a target in a plasma deposition chamber.

The invention relates to an interlayer assembly (100) having a first cover layer (101), a second cover layer (102) and a core layer (103). Because the core layer (103) is arranged between the first cover layer (101) and the second cover layer (102), the first cover layer (101), the core layer (103) and the second cover layer (102) form an interlayer structure. The core layer (103) has a shear stiffness greater than 5 MPa. The core layer (103) is configured to be recoverable such that at least 95% of the original thickness of the core layer (103) is recoverable when the thickness of the core layer (103) is reduced by 20% of the original thickness due to the compressive force.

The invention relates to a photomask detection structure and a detection method thereof. The method comprises the following steps: a)providing a photomask, wherein the photomask has a chromium crystal rings array composed of mutual-isolated chromium crystal rings; b)determining a scope of an inspection area in the photomask, arranging a horizontal frame and a vertical frame at most external side in the chromium crystal ring array in the inspection area, setting as a non-inspection area; c)setting a first non-inspection area array in the photomask, covering the horizontal frame and the vertical frame in the chromium crystal ring array to form the non-inspection areal; d)arranging a second non-inspection area array in the photomask, covering a beveling frame of the chromium crystal ring in the chromium crystal ring array to form the non-inspection area. The method can ensure the largest detection area and the smallest which can be obtained, defect existence risk is reduced, and the obtained accurate detection result is more accurate.

A laminated packaging material for liquid food products comprising, a core layer of paper or paperboard or other cellulose-based material, a laminate portion being arranged on a first side of the core layer, a dark colored flexographic ink composition printed onto the free surface of the laminate portion, the dark colored ink composition comprises color bases mixed at a ratio such that a total energy absorption by the dark colored flexographic ink composition, when provided on the laminated packaging material, is below 80%, such as below 70% in an emission spectra from a tungsten light source in the region 250-2500 nm at a temperature of 3000 K, the dark colored flexographic ink composition has a color space lightness value L*≤25, and a color space difference equal to or lower than 6, with respect to a specified black reference composition.

The invention relates to the technical field of water-based paint, in particular to heat-preservation water-based paint capable of being constructed at low temperature and a preparation method of the heat-preservation water-based paint. The heat-preservation water-based paint is prepared from the following raw materials in percentage by weight: 0.2 to 0.6 percent of dispersing agent, 0.1 to 0.4 percent of hydroxyethyl cellulose, 0.1 to 0.4 percent of defoaming agent, 0.2 to 0.5 percent of wetting leveling agent, 1 to 4 percent of anti-freezing agent, 0.8 to 2 percent of coalescing agent, 14 to 18 percent of titanium dioxide, 0.4 to 1.2 percent of fumed silica, 0.7 to 1.7 percent of sericite, 4 to 7 percent of nano coated ceramic microbeads, 1.5 to 6 percent of expanded perlite, 7 to 13 percent of floating beads, 6 to 12 percent of aerogel, 0.3 to 0.7 percent of thickening agent, 0.05 to 0.25 percent of mildew preventive and the balance of water. The coating is prepared from the following components in percentage by weight: 0.05-0.25% of a light stabilizer, 0.2-0.6% of an ultraviolet light absorber, 1.5-4% of a silane coupling agent, 9-14% of deionized water and the balance of hydroxyl acrylic emulsion. The thermal-insulation water-based paint has the advantage that the thermal-insulation water-based paint can be constructed at a low temperature.

The invention provides a post-processing method of a mask having a defect pattern; a shadow is formed in quartz glass at a position having a defect pattern by a laser so as to reduce the light transmittance of the position having the defect pattern, in the process of using the mask having the defect pattern for exposure, the defect pattern is avoided from being formed on a wafer, a risk of defect generation of the wafer after a photolithography technology is reduced, and a mask having the defect is reused, so as to avoid the problems of high manufacturing costs brought by repairing the mask having the defect or re-manufacturing a mask, namely reduce the manufacturing costs; and at the same time, the production yield is improved.

The invention relates to a camera module and an assembly method thereof. The camera module comprises a photosensitive component with a photosensitive chip and a lens component. The method comprises the following steps: arranging a first adhesive material on one surface of the photosensitive component; irradiating the first adhesive material by using ultraviolet light with a first wavelength to start first curing of the first adhesive material; during the first curing period of the first adhesive material, adjusting the relative position of the lens assembly and the photosensitive assembly, enabling the lens assembly to be in contact with the first adhesive material, and irradiating the first adhesive material by ultraviolet light with a second wavelength, so that second curing of the first adhesive material is completed, wherein in the second curing step, the first adhesive material is partially cured, and the second wavelength is different from the first wavelength; and waiting for the completion of the first curing of the first adhesive material.

The invention relates to the technical field of mobile phone manufacturing, and discloses a mobile phone display screen turn-over processing and carrying device. The device comprises a base, a carrying-in seat is arranged at the upper end of the left side of the base, a carrying-in rail is arranged in the carrying-in seat, a control rod is arranged above the carrying-in rail, and a cooperating block is arranged at the free end of the control rod. A carrying-in trolley is movably connected to the upper end of the cooperating block, a turn-over seat is arranged on the right side of the carrying-in seat, an index wheel is arranged on the front side of the turn-over seat, a butt joint support is arranged at the position, right facing the carrying-in trolley, of the rear portion of the index wheel, push rods are arranged on the upper side and the lower side of the butt joint support, and a movable core is arranged in the butt joint support. According to the mobile phone display screen turn-over processing and carrying device, clamping jaws rotate to the right side along with the butt joint support under control of the index wheel, turning over is completed, meanwhile, adjustable supports arranged at the upper end of a carrying-out rotary table are used in cooperation, and carrying out is completed; and due to the fact that the speed of the rotary turn-over manner is far larger thanthat of mechanical arm control operation, efficiency can be effectively improved in production, and cost is saved.