Electronic element, plastic coating technology of microswitch with resistor and microswitch with resistor

Abstract

The invention discloses an electronic element, a plastic coating technology of a microswitch with a resistor and the microswitch with the resistor. According to the plastic coating technology, plasticcoating production is performed for the electronic element in a sequential low-temperature low-pressure and high-temperature high-pressure injection molding plastic coating mode, wherein low-temperature low-pressure plastic coating is performed in advance for protection so that the internal structure of the electronic element can be effectively kept stable in the plastic coating process, the phenomena of displacement, falling and the like in the subsequent assembly process are prevented, and then high-temperature high-pressure plastic coating is carried out to improve the vibration resistance, impact resistance and waterproof capability of the electronic element; based on the plastic coating technology, in the production of the microswitch with the resistor, the microswitch with the resistor with good vibration resistance, impact resistance and waterproofness can be produced, the resistor is protected through low-temperature low-pressure plastic coating in advance, the resistor can beeffectively prevented from displacement, falling off and the like in the subsequent assembly process, the internal structure of the microswitch with the resistor can be effectively kept stable, and the product quality stability is greatly improved.

Description

technical field [0001] The invention relates to the technical field of production of electronic components, in particular to a double-layer overmolding process for electronic components, a overmolding process for a micro switch with resistance and a micro switch with resistance. Background technique [0002] Electronic components are basic elements in electronic circuits, usually individually packaged, and have two or more leads or metal contacts. In the production of electronic components, injection molding is required to form a protective layer to prevent components such as leads from detaching or shifting to cause electronic components to fail, and to effectively protect components in electronic components from leakage or environmental interference damage. [0003] However, the existing injection molding overmolding in the production process of electronic components usually adopts one-time injection molding overmolding, and the injection molding process is directly carri...

AI Technical Summary

Problems solved by technology

Among them, the high temperature is easy to make the components inside the electronic components more or less damaged, the service life is reduced, or the connection material between the components is melted, which leads to the failure of the connection relationship between the components or short circuit phenomenon; while the high voltage is easy Causing detachment or displacement of components inside electronic components

For example, in the micro switch disclosed in Chinese patent CN209328736U, a resistor is connected between the terminals, and the two ends of the resistor are welded on the terminal by solder paste. , the high temperature will not only damage the resistance more or less, but also melt the solder paste and cause the resistance to shift under high pressure, making the micro switch invalid, and the melted solder paste will enter into the two The gap between the terminals so that there is a short circuit between the two terminals

Moreover, because the electronic components produced by injection molding are usually inspected after the entire injection molding is completed, and the internal structure is invisible to the naked eye during the entire injection molding process, even if the internal structure changes, the injection molding process cannot be stopped

It can be seen that under such a high temperature and high pressure injection molding overmolding process, the scrap rate of the electronic components produced is extremely high, and the material waste is extremely serious, which greatly increases the production cost and the production efficiency of the electronic components is low.

In addition, if the packaging is directly carried out under low temperature and low pressure, the products produced cannot withstand high temperatures, and have poor waterproof performance, low strength, and poor practical applicability.

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