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Photomask detection structure and detection method thereof

A detection structure and detection method technology, applied in the semiconductor field, can solve the problems of not being detected, the risk of detection results, etc.

Active Publication Date: 2015-09-16
SEMICON MFG INT (SHANGHAI) CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] After completing the preparation of the PSM, it is necessary to detect the defects of the PSM to get rid of the defects in the PSM. In the inspection of the defects, it is not necessary to detect the chromium crystal ring, so the chromium crystal ring The ring is set as a do not inspection region (DNIR), and other regions are set as inspection regions to detect the PSM. At present, there are three methods for setting the chromium crystal ring as DNIR, as follows: Figure 1a-1c shown, as Figure 1a As shown, an inspection region 11 is set in the chromium crystal ring 10, and the area of ​​the inspection region is smaller than the area of ​​the chromium crystal ring 10, so as to exclude the chromium crystal ring from the detection area, but the The problem with the method is that there is still a large part between the chromium crystal ring 10 and the inspection area that has not been detected, such as Figure 1a As shown in the area 12 filled in the upper left corner of the center, it brings great risks to the detection results; the second method is as follows Figure 1b As shown, firstly, the inspection area 11 is set on the inner side of the array of chrome crystal rings 10, so that the outermost frame of the chrome crystal rings 10 is set as DNIR, and then cutting lines are set in the array of chrome crystal rings Array, the dicing line array is a plurality of horizontal or vertical strip structures, so as to cover the horizontal and vertical frames inside the chromium crystal ring array to form a DNIR area, but the disadvantage of the method is that it cannot Set the oblique frame inside the chrome crystal ring array as the DNIR area; the third method is as attached Figure 1c As shown, wherein the method is a further improvement on the second method, specifically increasing the width of the cutting line arranged in the vertical direction so as to cover the hypotenuse of the chromium crystal ring to form a DNIR region, But the shortcoming of described method is, described kerf coverage area is too big, causes such as Figure 1c The area 12 filled in the upper left corner of the center cannot be detected, and there are similar areas in each chromium crystal ring, which brings great risk to the detection results

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  • Photomask detection structure and detection method thereof
  • Photomask detection structure and detection method thereof
  • Photomask detection structure and detection method thereof

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Embodiment 1

[0054] The detection method of the photomask of the present invention will be further described below in conjunction with the accompanying drawings. In this embodiment, the phase shift photomask is used as an example for illustration, but it should be noted that this embodiment is only for illustrative purposes. The above method is not limited to the phase shift mask, and can also be applied to a type of mask in which the chrome crystal ring pattern is set as a non-detection area.

[0055] The method of the present invention comprises:

[0056] Step (a) providing a phase shift mask, the phase shifter has a chromium crystal ring array composed of mutually isolated chromium crystal rings 20;

[0057] Step (b) Determine the scope of the inspection area 21 in the phase shift mask, so that the outermost horizontal frame and vertical frame in the chrome crystal ring array are set outside the inspection area 21, set to non- inspection area;

[0058] Step (c) setting a first non-ins...

Embodiment 2

[0084] The present invention also provides a detection structure of a phase shift mask, including:

[0085] The array of chrome crystal rings, located in the phase shift mask, includes mutually isolated chrome crystal rings 20;

[0086] The inspection area 21 is located in the phase shift mask, so that the outermost horizontal frame and vertical frame in the chrome crystal ring array are set outside the inspection area 21 and set as a non-inspection area;

[0087] The first non-inspection area array 22 is located in the phase shift mask and covers the horizontal frame and the vertical frame of the chromium crystal ring inside the chrome crystal ring array to form a non-inspection area;

[0088] The second non-inspection area array 23 is located in the inspection area 21 and covers the hypotenuse frame inside the chromium ring array to form a non-inspection area.

[0089]Wherein, the detection structure further includes a third non-inspection area array 24, which is located in...

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Abstract

The invention relates to a photomask detection structure and a detection method thereof. The method comprises the following steps: a)providing a photomask, wherein the photomask has a chromium crystal rings array composed of mutual-isolated chromium crystal rings; b)determining a scope of an inspection area in the photomask, arranging a horizontal frame and a vertical frame at most external side in the chromium crystal ring array in the inspection area, setting as a non-inspection area; c)setting a first non-inspection area array in the photomask, covering the horizontal frame and the vertical frame in the chromium crystal ring array to form the non-inspection areal; d)arranging a second non-inspection area array in the photomask, covering a beveling frame of the chromium crystal ring in the chromium crystal ring array to form the non-inspection area. The method can ensure the largest detection area and the smallest which can be obtained, defect existence risk is reduced, and the obtained accurate detection result is more accurate.

Description

technical field [0001] The invention relates to the field of semiconductors, and in particular, the invention relates to a detection structure and a detection method of a photomask. Background technique [0002] With the continuous development of semiconductor technology, the preparation of semiconductor devices tends to be miniaturized, and has been developed to the nanometer level, while the preparation process of conventional devices is gradually mature. In the manufacturing process of semiconductor devices, the design circuit is firstly obtained by lithography imaging, and then the design pattern is precisely defined on the photomask through the manufacturing process, and the pattern on the photomask is transferred to the semiconductor substrate by using the etching process to manufacture Get the required line structure. [0003] With the continuous development of semiconductor technology, phase shift mask (Phase Shift Mask, PSM) has been widely used. PSM adopts double-...

Claims

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Application Information

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IPC IPC(8): G03F1/44
CPCG03F1/44
Inventor 凌文君
Owner SEMICON MFG INT (SHANGHAI) CORP
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