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Camera module and assembly method for camera module

A technology of a camera module and an assembling method, which is applied in the directions of image communication, parts of color TVs, parts of TV systems, etc. The effect of reducing the number of transfers and reducing the risk of defects

Active Publication Date: 2021-12-10
NINGBO SUNNY OPOTECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the increase in temperature may affect the various components in the lens assembly, thereby deteriorating the overall performance of the camera module and reducing the image quality
At the same time, due to the different thermal expansion coefficients of the circuit board, photosensitive chip, package and other components in the photosensitive component, the increase in temperature will cause the expansion speed and expansion of each component to be unbalanced, resulting in the bending of the photosensitive chip and reducing the imaging quality.
At the same time, the color filter placed on the top of the photosensitive component will also reduce its light filtering performance due to high temperature.

Method used

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  • Camera module and assembly method for camera module
  • Camera module and assembly method for camera module
  • Camera module and assembly method for camera module

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Embodiment Construction

[0037] For a better understanding of the application, various aspects of the application will be described in more detail with reference to the accompanying drawings. It should be understood that these detailed descriptions are descriptions of exemplary embodiments of the application only, and are not intended to limit the scope of the application in any way. Throughout the specification, the same reference numerals refer to the same elements. The expression "and / or" includes any and all combinations of one or more of the associated listed items.

[0038] It should be noted that in this specification, expressions of first, second, third, etc. are only used to distinguish one feature from another, and do not represent any limitation on the features.

[0039]It should also be understood that the terms "comprising", "comprising", "having", "comprising" and / or "comprising", when used in this specification, mean that the stated features, elements and / or parts are present , but do...

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Abstract

The invention relates to a camera module and an assembly method thereof. The camera module comprises a photosensitive component with a photosensitive chip and a lens component. The method comprises the following steps: arranging a first adhesive material on one surface of the photosensitive component; irradiating the first adhesive material by using ultraviolet light with a first wavelength to start first curing of the first adhesive material; during the first curing period of the first adhesive material, adjusting the relative position of the lens assembly and the photosensitive assembly, enabling the lens assembly to be in contact with the first adhesive material, and irradiating the first adhesive material by ultraviolet light with a second wavelength, so that second curing of the first adhesive material is completed, wherein in the second curing step, the first adhesive material is partially cured, and the second wavelength is different from the first wavelength; and waiting for the completion of the first curing of the first adhesive material.

Description

technical field [0001] The present application relates to the technical field of optical imaging. More specifically, the present application relates to a camera module and an assembly method for assembling the camera module using exposure technology. Background technique [0002] With the popularization of mobile electronic devices, technologies related to camera modules used in mobile electronic devices to help users acquire images (eg, video or images) have been rapidly developed and improved. In addition, in recent years, camera modules have been widely used in many fields such as medical treatment, security protection, and industrial production. [0003] In order to meet more and more extensive market demands, high pixel, small size, and large aperture are irreversible development trends of existing camera modules. At present, the market has put forward higher and higher demands on the imaging quality of camera modules. Factors affecting the resolution of a camera mod...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04N5/225
CPCH04N23/50
Inventor 蒋恒孟楠黄铭富
Owner NINGBO SUNNY OPOTECH CO LTD
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