Copper thickness self-identification and adhesive shortage risk warning system for multi-layer circuit board without copper area
A multi-layer circuit and circuit board technology, applied in printed circuit testing, electronic circuit testing, etc., can solve the problems of glue shortage risk early warning error, low glue shortage risk early warning sensitivity, glue shortage risk impact, etc.
Active Publication Date: 2020-05-12
DALIAN CHONGDA CIRCUIT
View PDF9 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0004] The above existing methods have the following defects: 1) When the shape of the copper-free area is irregular, the accurate size calculation of the area cannot be performed, resulting in an error in the early warning of the risk of glue shortage; 2) Under the copper-free area of the same size, the multi-layer inner layer The cumulative copper thickness of the plate under the copper-free area has a great influence on the risk of glue shortage. Ignoring the cumulative copper thickness will lead to low sensitivity of glue shortage risk warning
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0017] The specific embodiment of the present invention will be further described in detail below in conjunction with the accompanying drawings.
[0018] It should be noted that, in the following specific embodiments, when describing the embodiments of the present invention in detail, in order to clearly show the structure of the present invention for the convenience of description, the structures in the drawings are not drawn according to the general scale, and are drawn Partial magnification, deformation and simplification are included, therefore, it should be avoided to be interpreted as a limitation of the present invention.
[0019] In the following specific embodiments of the present invention, please refer to figure 1 and figure 2 . A multilayer circuit board copper thickness self-identification and adhesive shortage risk early warning system, including a layer unit division module, a layer unit local residual copper rate calculation module, a board unit cumulative c...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention discloses an automatic identification early-warning system for a no-copper area of a multilayer circuit board. The system comprises a layer unit dividing module, a layer unit copper remaining rate calculating module, a board unit accumulated copper thickness calculating module, a board unit glue shortage risk determining module and an output module. The automatic identification early-warning system has advantages of performing more accurate pre-estimation on a glue shortage risk of the circuit board, grading defect conditions so as to take corresponding measures, and greatly reducing the glue shortage risk in a printed circuit board pressing process.
Description
technical field [0001] The invention relates to the field of printed circuit board manufacturing, and more specifically, to a multilayer circuit board copper thickness self-identification and adhesive shortage risk warning system. Background technique [0002] In the lamination process of multilayer / high multilayer printed circuit boards, the lack of glue and scrapping is a major problem faced by the lamination process. One of the causes of abnormal glue shortage is the difference in the cumulative copper thickness of the inner copper-free area design. Large, the local pressure in the copper-free area is too small, and the resin flow and bonding are poor. [0003] At present, the industry's solution to the above problems is: in the design of the inner copper-free area, use the defined size of the copper-free area to warn of the risk of glue shortage circuit boards, that is, when the size of the copper-free area exceeds the defined size, for example, when the copper-free area...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Patents(China)
IPC IPC(8): G01R31/28
CPCG01R31/2805
Inventor 马东辉
Owner DALIAN CHONGDA CIRCUIT