A full-color stacked epitaxy micro-led array preparation method
A stacking and epitaxy technology, applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of large size of a single light-emitting unit, inability to highly integrated assembly, low screen resolution, etc., to reduce the probability of contamination and increase the number of devices. Yield, the effect of improving resolution
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[0062] The embodiments of the present invention are described in detail below. Examples of the embodiments are shown in the accompanying drawings, in which the same or similar reference numerals indicate the same or similar elements or elements with the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary, and their dimensions do not represent the actual dimensions of the present invention, but are only used to explain the present invention, and cannot be understood as a limitation to the present invention.
[0063] Reference below figure 1 A full-color stacked epitaxial Micro-LED array structure according to an embodiment of the present invention is described. It includes: a conductive substrate 1, a micro-isolation structure prepared on the conductive substrate 1, a plurality of p-side electrode lead regions 7 and current injection regions 8 arranged in columns on the micro-isolation structure 2 , And a number of s...
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