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A UV-curable adhesive suitable for bonding non-transparent materials

A technology of ultraviolet light and curing glue, applied in the field of ultraviolet light curing, can solve the problem of inability to achieve bonding between non-transparent materials, and achieve the effects of high stability in use, good application performance and high bonding strength

Active Publication Date: 2021-03-30
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to solve the problem that the existing UV-curable adhesive cannot realize the bonding between non-translucent materials, and provide a UV-curable adhesive that can be used between light-transmitting materials and non-translucent materials

Method used

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  • A UV-curable adhesive suitable for bonding non-transparent materials
  • A UV-curable adhesive suitable for bonding non-transparent materials
  • A UV-curable adhesive suitable for bonding non-transparent materials

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] Weigh 12.5g of 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexyl carboxylate (CELLOXI DE 2021P), 3.5g of tetraepoxycyclosiloxane (Designer Molecules Inc CS-697), 3,3-(oxybismethylene)-bis-(3-ethyl)oxetane (OXT 221) 1.0g, glycerol 0.5g, γ-glycidyl etheroxypropyltrimethoxy Add 0.1 g of silane into the reaction kettle at a speed of 800 rpm / min, stir at room temperature for 30 minutes, then add 0.3 g of photoinitiator (CibaIrgacure 261) into the reaction kettle, and continue stirring for 60 minutes. After the solution was stirred evenly, 5.2 g of nano silicon micropowder was weighed, and 0.8 g of fumed silica was added to the reaction kettle. Continue to stir for 3 hours under the process of temperature 20°C, vacuum degree -0.1MPa, and rotation speed 1000rpm / min to obtain the finished product.

Embodiment 2

[0025] Weigh 16g of bis((3,4-epoxycyclohexyl)methyl)adipate (UVR 6128), 2.5g of tetraepoxycyclosiloxane (Designer Molecules Inc CS-697), β-(3, 4-epoxycyclohexylethyl) trimethoxysilane 0.1g, 1,4-butanediol 0.8g joins in the reactor, rotating speed 800rpm / min, stirs at room temperature 30min, then adds photoinitiator ( Ciba Irgacure 261) 0.5g, continue stirring for 60 min. After the solution was evenly stirred, 4.7 g of nano silicon micropowder was weighed, and 0.7 g of fumed silica was added into the reaction kettle. Continue to stir for 3 hours under the process of temperature 20°C, vacuum degree -0.1MPa, and rotation speed 1000rpm / min to obtain the finished product.

Embodiment 3

[0027] Weigh 15g of the polymerization product of 3,4-epoxycyclohexylmethyl 3,4-epoxycyclohexyl carboxylate and caprolactone (TTA 2083 from Jiangsu Taitel New Material Technology Co., Ltd.), tetraepoxycyclosiloxane Add 5g of alkane (Designer Molecules Inc CS-697), 2.5g of vinyl cyclohexyl ether, 0.2g of γ-mercaptopropyltrimethoxysilane, and 2.3g of polycaprolactone polyol into the reaction kettle at a speed of 800 rpm / min , stirred at room temperature for 30 minutes, then added 0.2 g of photoinitiator (CibaIrgacure 261) into the reaction kettle, and continued to stir for 60 minutes. After the solution was evenly stirred, 8 g of nano-silica powder was weighed, and 1 g of fumed silica was added to the reaction kettle. Continue to stir for 3 hours under the process of temperature 20°C, vacuum degree -0.1MPa, and rotation speed 1000rpm / min to obtain the finished product.

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Abstract

Provided is an ultraviolet light curing adhesive suitable for bonding light-proof materials. The ultraviolet light curing adhesive is prepared from, by mass, 30-50% of epoxy resin, 5-25% of functionalresin, 2-20% of diluent, 0.3-4% of photo-initiator, 0.5-5% of coupling agent and 20-55% of filler. The prepared ultraviolet light curing adhesive can excite the photo-initiator to form a latent curing adhesive layer at a condition of low energy (500-1500 mj), and the curing delay time (3-5 min) is long, so that the prepared ultraviolet light curing adhesive is greatly suitable for bonding the light-proof materials; after photo-initiation, the ultraviolet light curing adhesive has elementary bonding strength when placed for 1 hour at normal temperature, and an adhesive layer can be completelycured after 12 hours; in order to increase the curing speed, a device can also be heated, and the adhesive layer can be completely cured after being heated at 60 DEG C for 10 minutes. The ultravioletlight curing adhesive suitable for bonding the light-proof materials is not only good in universality and flexible in operation but also good in toughness, low in retraction rate, high in bonding strength, good in application performance and relatively high in application stability.

Description

technical field [0001] The invention relates to an ultraviolet curing adhesive suitable for bonding non-transparent materials, and belongs to the technical field of ultraviolet curing. Background technique [0002] With the rapid development of the information industry, UV curing technology has been widely used in the electronics industry, printing industry, and fine processing fields due to its advantages of energy saving, environmental protection, high efficiency, and economy. However, the traditional UV curing technology requires at least one side of the adhered material to be able to transmit ultraviolet light. If the adhered material is opaque, the photoinitiator cannot be activated, and the UV-cured adhesive cannot be used, which limits the use of ultraviolet light. The application of light curing technology in some special fields. [0003] According to different initiation mechanisms, photocuring systems are divided into free radical photocuring and cationic photocur...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/00C09J11/04C08G59/32
CPCC08G59/3281C08K3/36C08K2201/011C08K2201/014C09J11/04C09J163/00
Inventor 刘平王建斌陈田安解海华
Owner YANTAI DARBOND TECH
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