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Ultraviolet-anaerobic dual curing adhesive

A dual-curing, adhesive technology, used in adhesives, non-polymer organic compound adhesives, epoxy resin adhesives, etc., can solve the problems of difficult curing, unable to achieve sealing effect, etc., achieve fast curing speed and meet the bonding strength. requirements, the effect of improving the bonding strength

Active Publication Date: 2011-04-27
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It is mainly used for sealing and screw locking of screws and mating surfaces. However, due to the need to isolate the air for curing, the extruded glue line is difficult to cure when exposed to the air, and the ideal sealing effect cannot be achieved.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0019] 1. The composition and ratio of UV-anaerobic dual curing adhesive. The UV-anaerobic dual-curing adhesive of Example 1-28 of the present invention is made of the following raw materials in parts by weight: prepolymer: 100-135 parts; diluent: 10-75 parts; photoinitiator: 1-4 parts Accelerator: 0.3-0.6 parts; Reducing agent: 0.2-0.5 parts; Oxidizing agent: 0.5-1.1 parts; Chelating agent: 0.5-1.5 parts; Inhibitor: 0.2-0.5 parts. The numerical values ​​of each corresponding weight ratio (expressed in parts by weight) are shown in Table 1, Table 2, Table 3, and Table 4 (symbol " / " in the table means nothing).

[0020] 2. Performance test. Coat one end of the stainless steel substrate with the above-mentioned adhesive, and then cover another piece of transparent PCV sheet on the coating layer, irradiate it with a 400w ultraviolet light for 6 seconds, and place it for 24 hours. Shear strength test.

[0021] Table 1

[0022] ...

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PUM

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Abstract

The invention discloses ultraviolet-anaerobic dual-curing adhesive which is made from the following raw materials of corresponding part by weight: 100 to 135 portions of prepolymer, 10 to 75 portions of diluent, 1 to 4 portions of light initiator, 0.3 to 0.6 portion of accelerant, 0.2 to 0.5 portion of reducing agent, 0.5 to 1.1 portions of oxidant, 0.5 to 1.5 portions of chelating agent and 0.2 to 0.5 portion of polymerization inhibitor. The adhesive of the invention has fast curing speed and can obtain initial bonding strength after being irradiated by ultraviolet for seconds; by means of anaerobic curing mechanism, crosslinking curing is continued after the ultraviolet is removed, thereby further improving the bonding strength of the adhesive so as to meet the requirements of bonding strength of devices in the electronic and electric appliance industries.

Description

technical field [0001] The invention relates to a curing adhesive, in particular to an ultraviolet-anaerobic dual curing adhesive. Background technique [0002] UV-curable adhesives have the characteristics of long storage period, no solvent, and low odor during and after curing. The more prominent advantages are fast curing speed and good comprehensive performance. UV-curable adhesives cure instantly when exposed to UV light, much faster than water-based adhesives or even hot-melt adhesives. At the same time, the UV-curable adhesive has a network cross-linked structure, which has excellent heat resistance, water resistance, and chemical resistance. Therefore, under the condition of fast curing and high performance, the use of UV-curable adhesive is the best. good choice. Moreover, the UV-curable adhesive is cured at room temperature, which can avoid thermal damage to the substrate and thermal burns to the operator, so it is safer. The curing mechanism of UV-curable adhes...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J175/14C09J163/00C09J167/06C09J4/00C09J9/00
Inventor 袁文辉包罗涛李莉戴险峰
Owner SOUTH CHINA UNIV OF TECH
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