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Intelligent sealing device for chip packaging and its working principle

A sealing device and intelligent technology, applied in the field of microwave communication, can solve the problems of high labor intensity and low production efficiency, and achieve the effects of high sealing quality, saving manpower and material resources, and flexible adjustment and fixing.

Active Publication Date: 2020-07-17
康佳芯云半导体科技(盐城)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to solve the above-mentioned problems of low production efficiency, high labor intensity and potential safety hazards, the present invention proposes a sealing device for chip packaging and its working principle

Method used

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  • Intelligent sealing device for chip packaging and its working principle
  • Intelligent sealing device for chip packaging and its working principle
  • Intelligent sealing device for chip packaging and its working principle

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Experimental program
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Embodiment

[0019] An intelligent sealing device for chip packaging, comprising a power supply module, and further comprising: a feeding port, welded with the sealing machine 6, and electrically connected with a control module; the sealing machine 6, electrically connected with the control module; the control module, with the power supply module Electrical connection; sensor module, electrically connected with the control module; air cylinder, electrically connected with the control module, welded with the sealing machine 6; several support columns 4, welded with the sealing machine 6; display screen, electrically connected with the control module; buttons, with the control The module is electrically connected; the carding device is electrically connected to the control module, and is welded to the sealing machine 6; the sealing machine 6 includes: a housing 30, which is welded to the support column 4; a heating plate frame, which is welded to the housing 30; a cooling device, which is elec...

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Abstract

The invention belongs to the field of microwave communication, and particularly relates to an intelligent sealing device for packaging and sealing chips and a working principle for the intelligent sealing device. The intelligent sealing device for packaging the chips comprises a power module, a feed inlet, a sealing machine, a control module, a sensor module, an air cylinder, a plurality of support columns, a display screen, keys and a sorting device. The feed inlet is welded with the sealing machine and is electrically connected with the control module; the sealing machine is electrically connected with the control module; the control module is electrically connected with the power module; the sensor module is electrically connected with the control module; the air cylinder is electrically connected with the control module and is welded with the sealing machine; the support columns are welded with the sealing machine; the display screen is electrically connected with the control module; the keys are electrically connected with the control module; the sorting device is electrically connected with the control module and is welded with the sealing machine; the sealing machine comprises a shell and a heating plate frame, and the shell is welded with the support columns; the heating plate frame is welded with the shell. The intelligent sealing device and the working principle havethe advantage that the problems of low production efficiency, high labor intensity and potential safety hazards can be solved by the aid of the intelligent sealing device and the working principle.

Description

technical field [0001] The invention belongs to the field of microwave communication, and particularly relates to an intelligent sealing device used for chip packaging and sealing and its working principle. Background technique [0002] RF chips are widely used in electrical equipment. With the increase in the use of electrical appliances, the production of RF chips is also increasing; after the production of RF chips is completed, the RF chips need to be packaged. The bag mouth of the chip packaging bag is generally closed by heating and applying pressure at the sealing part to make the bag mouth hot-melt sealing. The traditional method of applying pressure is generally manual, which is labor-intensive, low in production efficiency, and has great safety hazards. SUMMARY OF THE INVENTION [0003] In order to solve the above-mentioned problems of low production efficiency, high labor intensity and potential safety hazards, the present invention proposes a sealing device fo...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B65B51/14B65B51/32B65B57/04
CPCB65B51/146B65B51/32B65B57/04B65B2051/105
Inventor 邓庆杰
Owner 康佳芯云半导体科技(盐城)有限公司