Method for disc loading of optical thin sheet devices

Abstract

The invention provides a method for disc loading of optical thin sheet devices. A ground glass slab with small flatness errors is used as a standard used before disc loading of the optical thin sheetdevices, the upper surfaces of the multiple fixed optical thin sheet devices are located on one plane, the problem that the surfaces of the optical thin sheet devices are uneven is solved, the follow-up grinding time is shortened, and the follow-up grinding difficulty is reduced. In addition, as the upper surfaces of the multiple fixed optical thin sheet devices are on one plane, the workblank thickness, increased by the uneven upper surfaces of the multiple fixed optical thin sheet devices, of the optical thin sheet devices is saved, and raw material cost is saved. Meanwhile, low-melting-point hot melt adhesive is used in the method, the heat stress of the optical thin sheet devices and the contractility of a bonding material are reduced, deformation of the optical thin sheet devices after machining and unloading is reduced, and the machining quality and the product yield are improved.

Description

technical field [0001] The invention relates to the technical field of optical processing, in particular to a method for loading an optical sheet device. Background technique [0002] The existing optical sheet mounting method is to first heat the cast iron sticky plate on an electric furnace, then apply the wax on the surface of the cast iron sticky plate, then place the optical thin film device on the cast iron sticky plate, and wait until the wax is completely immersed in the optical film. Between the sheet device and the cast iron sticky plate, the cast iron sticky plate is removed from the electric furnace, and the optical thin slice device is fixed on the cast iron sticky plate after the wax is cooled and solidified. The disadvantage of this method is that due to the different thickness of the wax layer, the thickness of the optical thin device itself has a tolerance. After the optical thin device is placed on the disk, the upper surfaces of multiple optical thin devic...

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Problems solved by technology

In addition, since the optical thin device is directly placed on the surface of the cast iron sticky disk, the heat is directly transmitted to the optical thin device. During the wax cooling process, due to the thermal stress of the optical thin device itself and the shrinkage force of the wax layer, the optical thin device is deformed, and After the grinding and polishing process is finished, the optical sheet device is lowered. At this time, due to the tension of the wax layer and the release of the stress of the optical sheet device itself, the deformation of the original optical sheet device rebounds, and the polished surface is deformed, which affects the processing quality.

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