An integrated circuit lead forming device

Abstract

The present invention provides an integrated circuit lead molding device. The integrated circuit lead molding device is composed of an upper mould assembly and a lower mould assembly; the upper mouldassembly includes a pressing block, a center column, and an upper mould seat; a round hole is formed at the center portion of the upper mould seat and is used for mounting the center column; the center column is a stepped cylindrical column; the center column is mounted in the round hole at the center portion of the upper mould seat through interference fit; a round hole is formed at the center ofthe pressing block, wherein the round hole is in interference fit with the center column; the pressing block is rectangular, is sized to match with a rectangular accommodating groove at the lower part of the upper mould seat and is in transitional fit with the rectangular accommodating groove; the pressing block sleeves the middle column; and the periphery of the pressing block is clamped in theaccommodating groove. With the integrated circuit lead molding device of the invention adopted, the molding of the leads of an integrated circuit can be effectively completed; positioning is reliable;the consistency of the molding of the leads is excellent; the surfaces of the leads are free of indentations; the molding sizes of the leads can be accurately controlled; the coplanarity of the molding of the leads is excellent; the molding efficiency of the leads is high; and batch production can be realized easily. The device has the advantages of simple and novel structure, convenient installation, simple operation, easiness in manufacture, and good use effect.

Description

technical field [0001] The invention relates to an integrated circuit lead forming device. Background technique [0002] With the continuous advancement of electronic technology, integrated circuit packaging technology has been greatly developed. Integrated circuit lead forming was originally a post-process of integrated circuit packaging, but in order to give designers more choices in the process of circuit board design space and can be used for program burning and simulation tests without soldering. Integrated circuits without lead forming are widely used in products, which brings about a problem, that is, it is necessary to perform soldering before soldering. At present, the lead forming of integrated circuits is mainly completed by manual methods. Although the forming flexibility is relatively large, the forming consistency is poor, the coplanarity of lead forming is poor, the work efficiency is low, and the process is not easy to control. , which has a greater impact o...

AI Technical Summary

Problems solved by technology

[0002] With the continuous advancement of electronic technology, integrated circuit packaging technology has been greatly developed. Integrated circuit lead forming was originally a post-process of integrated circuit packaging, but in order to give designers more choices in the process of circuit board design Space and the test of program burning and simulation can be carried out without soldering. Integrated circuits without lead forming are widely used in products, which brings about a problem, that is, the soldered At present, the lead forming of integrated circuits is mainly completed by manual methods. Although the forming flexibility is relatively large, the forming consistency is poor, the coplanarity of lead forming is poor, the work efficiency is low, and the process is not easy to control. , which has a greater impact on the welding of subsequent integrated circuits

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