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Packaging structure of optical fingerprint chip

A fingerprint chip and packaging structure technology, applied in the direction of acquiring/arranging fingerprints/palmprints, instruments, characters and pattern recognition, etc., can solve problems such as insufficient light source intensity, complicated production process, complex structure, etc., to simplify the stacking structure, reduce Production process, effect of reducing assembly process

Inactive Publication Date: 2018-06-08
SUZHOU SAIYUAN MICROELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The optical fingerprint chip package of this structure, because the LED light is externally installed, the light source intensity is not enough, so it is necessary to make a bracket for the LED light, and secondly weld the LED light to the substrate. The structure is complicated, the production process is complicated, and the cost is relatively high.

Method used

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  • Packaging structure of optical fingerprint chip

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Embodiment Construction

[0017] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0018] Such as figure 1 As shown, an optical fingerprint chip packaging structure includes a substrate 1, an optical sensing bare chip 2, a transparent and light-transmitting plastic package 3 made of glass fiber, and several linear light source LED lamps. The optical sensing bare chip 2 is attached to the middle of the upper surface of the substrate 1, and several linear light source LED lamps 4 are distributed around the optical sensing bare chip 2 and elect...

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Abstract

The invention discloses a packaging structure of an optical fingerprint chip. The packaging structure comprises a substrate, an optical sensing bare chip, a transparent and diaphanous plastic packagebody and a plurality of straight-line light source LED (Light Emitting Diode) lamps, wherein the optical sensing bare chip is packaged to the middle of the upper surface of the substrate; the plurality of straight-line light source LED lamps are distributed around the optical sensing bare chip and are electrically connected to the upper surface of the substrate; after the plastic package body covers the optical sensing bare chip and the plurality of straight-line light source LED lamps, the plastic package body is combined with the upper surface of the substrate to form an integral structure;and the optical sensing bare chip comprises an ontology part and a diffuse reflection part arranged at a certain included angle with the ontology part, the straight-line light source LED lamps emit straight-line ray, the straight-line ray is reflected to a corresponding finger sending area on the surface of the plastic package body via the diffuse reflection part, and the straight-line ray is subjected to small-hole imaging to the sensing area of the optical sensing bare chip from fingers for identification. The packaging structure is integrally packaged, a stacking structure is simplified, amodule assembling process is reduced, and production cost is lowered.

Description

technical field [0001] The invention relates to the technical field of fingerprint identification modules, in particular to an optical fingerprint chip packaging structure. Background technique [0002] With the rapid development of the mobile Internet era, the information interaction between mobile terminal users is also increasing exponentially. At the same time, various incidents of telecommunication fraud and identity information theft occur frequently, and the identification technology of user ID information is safe. The problem has become a hot topic of much attention. In the mobile Internet interaction, biometric technology has become an emerging interactive technology under the leadership of the times and is gradually recognized by the public. A new type of safe and reliable fingerprint identification technology is used in various fields. Applications in similar electronic devices bring good news to mobile Internet end users. [0003] At present, the traditional opt...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06K9/00
CPCG06V40/1318
Inventor 樊超
Owner SUZHOU SAIYUAN MICROELECTRONICS