Packaging structure of optical fingerprint chip
A fingerprint chip and packaging structure technology, applied in the direction of acquiring/arranging fingerprints/palmprints, instruments, characters and pattern recognition, etc., can solve problems such as insufficient light source intensity, complicated production process, complex structure, etc., to simplify the stacking structure, reduce Production process, effect of reducing assembly process
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[0017] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0018] Such as figure 1 As shown, an optical fingerprint chip packaging structure includes a substrate 1, an optical sensing bare chip 2, a transparent and light-transmitting plastic package 3 made of glass fiber, and several linear light source LED lamps. The optical sensing bare chip 2 is attached to the middle of the upper surface of the substrate 1, and several linear light source LED lamps 4 are distributed around the optical sensing bare chip 2 and elect...
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