Semiconductor device including multi-liner layer in trench
A technology of semiconductor and liner layer, applied in semiconductor devices, semiconductor/solid-state device manufacturing, transistors, etc., can solve the problem of difficult operation of transistors
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[0021] These and other features and advantages are described in or are apparent from the following detailed description of the various example embodiments.
[0022] figure 1 is a layout diagram of a semiconductor device 10 according to an example embodiment of the inventive concept, figure 2 is along figure 1 A cross-sectional view of the semiconductor device 10 taken along the line Y1-Y1', image 3 is along figure 1 A cross-sectional view of the semiconductor device taken along line X1-X1' in .
[0023] The semiconductor device 10 may include transistors, such as metal oxide semiconductor (MOS) transistors. The semiconductor device 10 may include an active region AR on a semiconductor substrate 12 , a trench isolation layer 16 and a multi-pad layer 30 .
[0024] The semiconductor substrate 12 may be a substrate including at least one of silicon (Si) and germanium (Ge). For example, semiconductor substrate 12 may be a Si substrate. The trench isolation layer 16 may be ...
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