Probe structure, test device and test method

Abstract

The invention discloses a probe structure which comprises a hollow probe head and a filling material. The filling material is arranged inside the first end of the hollow probe head. The first end contacts an object to be tested. At least one of the thermal expansion coefficient, thermo-optic coefficient and elasto-optic coefficient of the filling material is greater than a preset coefficient threshold. The second end of the hollow probe head is connected with a light transmitting optical fiber of a spectrum demodulator. The invention further discloses a test device and a test method. Accordingto the probe structure, the test device and test method, TFT testing can be well carried out.

Description

technical field [0001] The invention relates to the technical field of testing, in particular to a probe structure, a testing device and a testing method. Background technique [0002] COA technology, Color filter on array, is a technology that fabricates a color filter layer and a black matrix on an array substrate. This technology can effectively eliminate the problems of reduced aperture ratio and light leakage of the display device caused by the deviation between the color filter substrate and the array substrate when the color filter layer and the black matrix are fabricated on the color filter substrate. [0003] However, the inventor found that the prior art has the following problems when implementing the present invention: [0004] At present, when testing the transfer characteristics of thin-film transistors (TFTs) in COA products, the test probes of the drain (Drain) usually need to be pierced on the via holes, and due to the small size of the via holes, the ther...

AI Technical Summary

Problems solved by technology

[0004] At present, when testing the transfer characteristics of thin-film transistors (TFTs) in COA products, the test probes of the drain (Drain) usually need to be pierced on the via holes, and due to the small size of the via holes, the thermal expansion of the TFT during the transfer characteristic test will cause problems. Make the probe move out of the via, making the experiment fail

However, the transfer characteristic test takes a long time. If the test failure cannot be detected in time, time will be wasted and the test efficiency will be low.

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