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Integrated circuit board fault detection method and system based on electromagnetic characteristics

An integrated circuit board and fault detection technology, which is applied in measurement devices, material magnetic variables, material analysis by optical means, etc. Effect

Inactive Publication Date: 2018-06-19
河南飞优驰网络科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Using the AOI automatic optical inspection method to detect integrated circuit boards, although defects can be found quickly, it is powerless for functional inspections such as internal damage to components on integrated circuit boards
In addition, because the equipment using the AOI automatic optical inspection method is large in size and expensive, it is only suitable for industrial factory inspection equipment
[0003] At present, the maintenance of electronic devices, such as the maintenance of mobile phone circuit boards, often judges the fault range based on the experience of the maintenance personnel. , so that the maintenance time is long, and the maintenance is easy to cause secondary damage. This kind of maintenance efficiency is low, the maintenance time is long, and it cannot be repaired quickly and efficiently.

Method used

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  • Integrated circuit board fault detection method and system based on electromagnetic characteristics
  • Integrated circuit board fault detection method and system based on electromagnetic characteristics

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] Embodiment 1 provides an integrated circuit board fault detection method based on electromagnetic characteristics, such as figure 1 shown, including the following steps:

[0041] S1: Obtain the current electromagnetic induction intensity at each position of the integrated circuit board through the image sensor and the Hall sensor.

[0042] Specifically, the image sensor scans the image of the integrated circuit board to obtain first image information, the first image information includes the image information of each position on the integrated circuit board, and the first image information may also include Optionally, the image sensor can be set as a CCD photocoupling element, and multiple CCD photocoupling elements are used to scan the image of the integrated circuit board to obtain the first image information.

[0043] Then image processing is performed on the first image information, the image processing includes feature extraction, and position information of multi...

Embodiment 2

[0063] Embodiment 2 of the present invention provides an integrated circuit board fault detection system based on electromagnetic characteristics, such as figure 2 shown, including:

[0064] The image sensor is used to scan the integrated circuit board to obtain first image information.

[0065] Specifically, the image sensor can be set as a CCD photocoupling element, and the CCD photocoupling element is used to linearly scan the integrated circuit board to obtain first image information, and the first image information includes images of various positions on the integrated circuit board information, and the first image information may also include image information of various positions outside the integrated circuit board.

[0066] Further, the integrated circuit board fault detection system based on electromagnetic characteristics also includes:

[0067] The Hall sensor is used to perform electromagnetic induction scanning on the integrated circuit board to obtain a first...

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Abstract

The invention belongs to the technical field of integrated circuit board fault detection and provides an integrated circuit board fault detection method and system based on electromagnetic characteristics. The method comprises the steps as follows: acquiring the current electromagnetic induction intensity of each position of an integrated circuit board is acquired by an image sensor and a Hall sensor; performing amplification and analog-to-digital conversion processing on the current electromagnetic induction intensity to obtain the target electromagnetic induction intensity; comparing the target electromagnetic induction intensity with pre-stored initial electromagnetic induction intensity to obtain fault information of the integrated circuit board, wherein the fault information comprisespositions of fault points on the integrated circuit board; outputting the fault information of the integrated circuit board. By means of the method, the electromagnetic induction intensity of the integrated circuit board is acquired, positions of faults of the integrated circuit board can be detected effectively, and a maintenance person can quickly and accurately maintain the integrated circuitboard.

Description

technical field [0001] The invention relates to the technical field of fault detection of integrated circuit boards, in particular to a method and system for fault detection of integrated circuit boards based on electromagnetic characteristics. Background technique [0002] For the defect detection of integrated circuit boards, the current common detection method is AOI (Automatic Optic Inspection) automatic optical inspection. AOI automatic optical inspection is based on the principle of optics to detect common defects encountered in welding production of integrated circuit boards. When testing according to the AOI automatic optical inspection method, the PCB integrated circuit board is often automatically scanned by the camera, the image is collected, the tested solder joints are compared with the qualified parameters in the database, and the defects on the PCB are checked out through image processing, and passed Displays or automatic flags display or mark defects for repa...

Claims

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Application Information

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IPC IPC(8): G01N21/956G01N27/82
CPCG01N21/956G01N27/82G01N2021/95638
Inventor 袁然黎杨
Owner 河南飞优驰网络科技有限公司