Semiconductor packaging structure with pin side wall tin climbing function, and manufacturing process thereof

Abstract

The invention relates to a semiconductor packaging structure with a pin side wall tin climbing function, and a manufacturing process thereof. The semiconductor packaging structure comprises a base island and pins; the pin comprises a planar part and an arc-shaped part; the arc-shaped part is positioned on the outer side of the planar part; the convex surface of the arc-shaped part faces the outward lower side; a chip is arranged on the front surface of the base island; the chip is electrically connected with the pin through a metal bonding wire; the pins, the base island and the peripheral region of the chip are packaged with a plastic packaging material; and the outer surfaces of the planar part and the arc-shaped part are exposed from the plastic packaging material. The side edge tin-plating area of the pin can be enlarged effectively, and a condition that the residual air in the outer convex arc-shaped position of the pin cannot be discharged outwards can be avoided, thereby improving welding performance and welding reliability of the product.

Description

technical field [0001] The invention relates to a semiconductor packaging structure with the function of tin climbing on the sidewall of a pin and a manufacturing process thereof, belonging to the technical field of semiconductor packaging. Background technique [0002] With the development of modern technology, semiconductor packaging has been widely used. It is widely used in radar, remote control telemetry, aerospace, etc., which puts forward higher and higher requirements for its reliability. And the failure caused by poor semiconductor welding has attracted more and more attention, because this kind of failure is often fatal and irreversible. Therefore, it is very important to obtain a good soldering reliability in the semiconductor industry. The tin layer of the semiconductor soldering surface can make the soldering more solid, especially for automotive electronics. [0003] As we all know, QFN (Quad Flat No-lead Package) and DFN (Duad Flat No-lead Package) are leadl...

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Problems solved by technology

[0009] However, this kind of packaging structure that forms L-shaped outer leads or C-shaped outer leads by cutting ribs also has the following defects when forming L-shaped outer leads or C-shaped outer leads: first, when performing outer When the pins are formed, the outer pins are bent toward the side of the plastic package, Figure 1G and Figure 1H The inner pin at A will be affected by the rebound force of the metal, which will cause the metal pin to have the stress of being pulled away from the plastic package downwards, and in the case of this downward force, it is easy to cause A. Delamination occurs between the upper surface of the inner pin and the lower surface of the molding compound

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