Semiconductor package structure with pin sidewall tin climbing function and its manufacturing process
A technology of packaging structure and manufacturing process, which is applied in the direction of semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc., can solve problems such as delamination, increase the bonding area, improve welding performance and welding reliability Sexuality, the effect of saving equipment cost
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Embodiment 1
[0071] Example 1: The side leads are lower than the molding compound
[0072] like figure 2 , image 3 As shown, in this embodiment, a semiconductor package structure with the function of climbing tin on the side wall of the pins includes a base island 1 and pins 2, and the base island 1 and pins 2 are metal circuit layers formed by electroplating. The pin 2 is arranged around the base island 1, the pin 2 includes a plane part 2.1 and an arc part 2.2, the arc part 2.2 is located outside the plane part 2.1, and the arc part 2.2 and the plane part 2.1 The convex surface of the arc-shaped part 2.2 faces the outer lower side, and the front surface of the base island 1 is provided with a chip 4 through an adhesive substance or solder 3, and the chip 4 forms an electrical connection with the pin 2 through a metal bonding wire 5. Sexual connection, the pin 2, the base island 1 and the peripheral area of the chip 4 are encapsulated with a plastic encapsulant 6, and the outer surf...
Embodiment 2
[0084] Example 2: The height of the side pins is flush with the molding compound
[0085] like Figure 18 , Figure 19 As shown, in this embodiment, a semiconductor package structure with the function of climbing tin on the side wall of the pins includes a base island 1 and pins 2, and the base island 1 and pins 2 are metal circuit layers formed by electroplating. The pin 2 is arranged around the base island 1, the pin 2 includes a plane part 2.1 and a side wall part 2.3, the side wall part 2.3 is located outside the plane part 2.1, and the plane part 2.1 and the side wall part 2.3 The arc portion 2.2 is connected by a smooth transition, the convex surface of the arc portion 2.2 is facing the outer lower side, the front of the base island 1 is provided with a chip 4 through an adhesive substance or solder 3, and the chip 4 is connected through a metal bonding wire 5 To form an electrical connection with the pin 2, the base island 1, the pin 2 and the peripheral area of the...
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