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Wafer cleaning device and wafer cleaning method

A cleaning device and wafer technology, applied in cleaning methods and appliances, chemical instruments and methods, electrical components, etc., can solve problems such as poor cleaning effect, achieve the effects of ensuring quality, eliminating uneven cleaning, and avoiding residues

Active Publication Date: 2018-06-29
淮安西德工业设计有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The invention provides a wafer cleaning device and a wafer cleaning method, which are used to solve the problem of poor cleaning effect of the existing wafer cleaning device

Method used

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  • Wafer cleaning device and wafer cleaning method
  • Wafer cleaning device and wafer cleaning method

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Embodiment Construction

[0025] The specific implementations of the wafer cleaning device and the wafer cleaning method provided by the present invention will be described in detail below in conjunction with the accompanying drawings.

[0026] This specific embodiment provides a wafer cleaning device, with figure 1 It is a structural schematic diagram of a wafer cleaning device in a specific embodiment of the present invention. Such as figure 1 As shown, the wafer cleaning device provided in this specific embodiment includes a turntable 10, and the turntable 10 can rotate around its axial direction; The chamber 11 is provided with a carrier tray 12 inside the chamber 11, and the carrier tray 12 is used for carrying a wafer. During the process of cleaning wafers by using the wafer cleaning device provided in this specific embodiment, the wafers to be cleaned are placed on the carrier plate 12 in the chamber 11. Since the chamber 11 deviates from the The center of the turntable 10 is set. During the ...

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Abstract

The invention relates to the technical field of semiconductor manufacturing, in particular to a wafer cleaning device and a wafer cleaning method. The wafer cleaning device comprises a turnplate thatmay rotate around its axis; the part, deviated from the center of the turnplate, of the surface of the turnplate is provided with at least one chamber; a bearing plate is arranged in the chamber and used for bearing wafers. The defect that the center of a wafer is cleaned non-uniformly is effectively eliminated; residue of cleaning liquid at the center of the wafer is avoided, and wafer cleaning effect is improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a wafer cleaning device and a wafer cleaning method. Background technique [0002] With the rapid development of integrated circuit manufacturing technology, the feature size of integrated circuits is also continuously reduced, and the line width ratio is gradually increased. On a semiconductor wafer, the number of semiconductor devices continues to increase. In order to meet the requirements of increasing the number of semiconductor devices, a semiconductor wafer often includes semiconductor devices with a multi-layer structure, and the semiconductor devices on adjacent layers are electrically connected through a metal interconnection structure, thereby increasing the number of semiconductor devices on a specific area of ​​the wafer. The number of devices increases the integration of semiconductor devices. However, as the structure of integrated circuits bec...

Claims

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Application Information

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IPC IPC(8): B08B13/00H01L21/67
CPCB08B13/00H01L21/67023H01L21/67333
Inventor 李丹高英哲崔亚东张文福
Owner 淮安西德工业设计有限公司