AMP electronic element mounting base mold
An electronic component and mounting seat technology, applied in the field of AMP electronic component mounting seat molds, can solve the problems of waste of space, inability to stack in an orderly manner, and many shapes of AMP electronic components, achieve good heat dissipation efficiency, improve space utilization, structure simple effect
Inactive Publication Date: 2018-06-29
SHANGHAI LONGLIAN PACKAGING MATERIALS
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Problems solved by technology
[0003] When AMP electronic components are placed in the molding groove, they cannot be stacked in an orderly manner, which is very messy, and because there are many shapes of AMP electronic components, when placing AMP electronic components of various shapes in the forming groove, a lot of space will be wasted
Method used
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[0017] In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the present invention will be further described below in conjunction with specific illustrations.
[0018] see figure 1 , the AMP electronic component mounting seat mold provided by the present invention includes a molding table 100, and the section of the molding table 100 is an isosceles trapezoidal shape, which greatly improves the strength.
[0019] The four ends of the forming table 100 are arc-shaped, which can prevent the ends of the forming table 100 from being damaged when they collide.
[0020] A heat dissipation plate 110 is provided at the bottom of the forming table 100 , and the heat dissipation plate 110 is used to improve the heat dissipation efficiency of the forming table 100 and to increase the supporting strength of the forming table 100 .
[0021] A number of wavy heat dissipation anti-slip blocks are provided on the bott...
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The invention discloses an AMP electronic element mounting base mold. The AMP electronic element mounting base mold comprises a molding platform. A molding groove is formed in the molding platform. Atleast two transverse partition blocks are arranged in the molding groove at equal intervals. The transverse partition blocks divide the molding groove into a plurality of identical storage groove molding cavities. Each storage groove molding cavity is internally provided with two parallel horizontal plates. A strip-shaped groove is formed between the two horizontal plates. A plurality of supporting blocks are arranged on each horizontal plate at equal intervals. The supporting blocks on the two horizontal plates are symmetric. A clamping groove is formed by every two adjacent supporting blocks on each horizontal plate. The two side faces of each storage groove molding cavity are each provided with at least one demolding hole. Demolding mechanisms are arranged on the upper surfaces of thetwo sides of the molding platform correspondingly. The AMP electronic element mounting base mold is simple in structure, high in strength and good in heat dissipation efficiency. The space utilizationrate of molded electronic element mounting bases is greatly increased. Moreover, various shapes of electronic elements are fixed in order.
Description
technical field [0001] The invention relates to a mold, in particular to an AMP electronic component mounting seat mold. Background technique [0002] The existing AMP electronic component mounting base mould-molded electronic component mounting base generally includes a forming table on which several forming grooves are arranged, and AMP electronic components can be placed in each forming groove. [0003] When the AMP electronic components are placed in the molding groove, they cannot be stacked in an orderly manner, which is very messy, and because the AMP electronic components have many shapes, when placing the AMP electronic components of various shapes in the molding groove, a lot of space will be wasted. Contents of the invention [0004] In order to solve the above problems, the present invention provides an AMP electronic component mounting seat mold. [0005] To achieve the above object, the technical scheme of the present invention is as follows: [0006] An AM...
Claims
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IPC IPC(8): B29C33/00B25H1/00
CPCB29C33/00B25H1/0021
Inventor 包永安
Owner SHANGHAI LONGLIAN PACKAGING MATERIALS