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Semiconductor package and method for manufacturing semiconductor package

A semiconductor and package technology, applied in semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc., can solve problems such as component delamination and device failure

Active Publication Date: 2022-06-07
INFINEON TECH AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In the worst case, the stress can even lead to component delamination and device failure

Method used

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  • Semiconductor package and method for manufacturing semiconductor package
  • Semiconductor package and method for manufacturing semiconductor package
  • Semiconductor package and method for manufacturing semiconductor package

Examples

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Embodiment Construction

[0028] In the following detailed description, reference is made to the accompanying drawings, which illustrate, by way of illustration, specific examples in which the present disclosure may be practiced. However, it will be apparent to those skilled in the art that one or more aspects of the examples may be practiced with a lesser degree of specific detail. In other instances, well-known structures and elements are shown in schematic form in order to facilitate describing one or more aspects of the example. In this regard, directional terms such as "top," "bottom," "left," "right," "top," "bottom," etc. are used with reference to the orientation of the drawings being described.

[0029] Furthermore, to the extent that the terms "comprising", "having", "containing" or other variations are used in the Detailed Description or in the claims, these terms are intended to be inclusive in a manner similar to the term "comprising" . The terms "coupled" and "connected" and their deriv...

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Abstract

A method of manufacturing a semiconductor package includes providing a carrier, making an opening in the carrier, attaching a semiconductor chip to the carrier, and making an encapsulation covering the semiconductor chip.

Description

technical field [0001] The present invention relates to a semiconductor package, in particular a semiconductor package comprising a carrier having an opening, and a method for producing such a semiconductor package. Background technique [0002] The semiconductor package may include a carrier and a semiconductor chip attached to the carrier. The semiconductor chip and the carrier may have different coefficients of thermal expansion (CTE: Coefficient of Thermal Expansion), which may induce stresses in the semiconductor package, for example during manufacture of the semiconductor package or during operation. In the worst case, the stress can even lead to component delamination and device failure. Furthermore, certain applications, such as optoelectronic applications, may require structured carriers to provide an optical access to the semiconductor chip. Improved structuring concepts may be required to provide stress relief, improved optoelectronic packages, and more flexible...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/56H01L23/31
CPCH01L21/56H01L23/3114H01L23/3107H01L31/0203H01L2924/181H01L21/4846H01L24/06H01L24/13H01L24/16H01L24/48H01L24/81H01L33/54H01L33/642H01L2224/06181H01L2224/13147H01L2224/16227H01L2224/16235H01L2224/48227H01L2224/73204H01L2933/0033H01L2933/005H01L2221/68304H01L21/6836H01L23/13H01L23/49827H01L23/562H01L2924/00014H01L23/28H01L24/96
Inventor 陈淑雯张超发钟福兴郑家锋方子康穆罕默德萨努斯穆罕默德黄美晶黄胤生卜佩銮王春晖
Owner INFINEON TECH AG
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